Use of a low-alloyed copper alloy and hollow profile component made therefrom
View Patent ↗Use of a low-alloyed, phosphorus-deoxidized copper alloy (DHP-Cu) for manufacturing hollow profile components by internal high-pressure forming, the copper alloy having the following composition: 0.030 to 0.080 wt-% of at least one element of a group including tin (Sn), Zinc (Zn), iron (Fe), silver (Ag) and at least 99.90 wt-% of (Cu) as well as unavoidable impurities as the remainder. Because of its cold work hardening properties, such a copper alloy is especially suitable for the manufacture of hollow profile components by internal high-pressure forming.
1. A low-alloyed, phosphorus-deoxidized copper alloy consisting of:
0.030 to 0.050 weight percent tin;
0.002 to 0.007 weight percent silver;
0.005 to 0.010 weight percent iron;
0.015 to 0.040 weight percent phosphorus;
≧99.90 weight percent copper; and
unavoidable impurities.
2. The copper alloy according to claim 1 , wherein the tin is present in an amount of 0.050 weight percent.
3. A hollow profile component comprising:
an arrangement with a hollow profile, wherein the arrangement comprises a low-alloyed, phosphorus-deoxidized copper alloy, the copper alloy consisting of:
0.030 to 0.050 weight percent tin;
0.002 to 0.007 weight percent silver;
0.005 to 0.010 weight percent iron;
0.015 to 0.040 weight percent phosphorus;
≧99.90 weight percent copper; and
unavoidable impurities.
4. The hollow profile component according to claim 3 , wherein the tin is present in an amount of 0.050 weight percent.