Switch assembly
View Patent ↗A switch assembly movable between a closed position and open position includes a multilayer circuit. The multilayer circuit includes a first layer having a first conductive material disposed thereon, a second layer having a second conductive material disposed thereon, and a third layer disposed between the first the second layer, the third layer having an opening therein to permit contact between said first conductive material and said second conductive material when the switch assembly is in the closed position. An actuator such as a rubber dome enables a customer to provide a force to move the switch assembly between closed and open positions. The actuator also meets tactile feel requirements for customer actuated switch applications.
1. A switch assembly movable between a closed and open position, said switch assembly comprising:
a multilayer circuit comprising a first layer comprising opposed first and second surfaces, said first layer having a first conductive material disposed on said first surface thereof and a protrusion extending from said second surface thereof, a second layer having a second conductive material disposed thereon, and a third layer disposed between said first and second layer, said third layer having an opening therein to permit contact between said first conductive material and said second conductive material when said switch assembly is in said closed position; and
an actuator configured engage said protrusion to provide force to said first layer to permit said first conductive material and said second conductive material to contact in said closed position and to enable separation of said first conductive material and said second conductive material in said open position.
2. The switch assembly of claim 1 , wherein said first conductive material is coupled to said first layer by using a polymer thick film (PTF) technique and said first layer comprises a thermoplastic film substrate.
3. The switch assembly of claim 1 , wherein said second conductive material is coupled to said second layer by using a polymer thick film (PTF) technique and said second layer comprises a thermoplastic film substrate.
4. The switch assembly of claim 1 , wherein said actuator comprises a rubber dome mat.
5. The switch assembly of claim 1 , wherein said actuator is selected from the group consisting of a plunger bumper, a rubber dome mat, and an eyelet assembly.
6. The switch assembly of claim 1 , wherein said first layer has a first position and a second position, said first conductive material contacting said second conductive material when said first layer is in said first position and said first conductive material separate from said second conductive material when said first layer is in said second position.
7. The switch assembly of claim 6 , wherein a force applied by said actuator forces said first layer into said first position.
8. The switch assembly of claim 7 , wherein said first layer returns to said second position when said force is removed.
9. The switch assembly of claim 1 , wherein said multilayer circuit is hermitically sealed.
10. A multilayer circuit switch assembly having an open and closed position, said multilayer circuit comprising:
a first layer comprising opposed first and second surfaces, said first layer having a first conductive material disposed on said first surface thereof and a protrusion extending from said second surface thereof for engaging an actuator;
a second layer having a second conductive material disposed thereon; and
a third layer disposed between said first and second layer, said third layer having an opening therein to permit contact between said first conductive material and said second conductive material when said multiple layer circuit is in a closed position.
11. The multilayer circuit switch assembly of claim 10 , wherein said first conductive material is coupled to said first layer by using a polymer thick film (PTF) technique and said first layer comprises a thermoplastic film substrate.
12. The multilayer circuit switch assembly of claim 10 , wherein said second conductive material is coupled to said second layer by using a polymer thick film (PTF) technique and said second layer comprises a thermoplastic film substrate.
13. The multilayer circuit switch assembly of claim 10 , wherein said first layer has a first position and a second position, said first conductive material contacting said second conductive material when said first layer is in said first position and said first conductive material separate from said second conductive material when said first layer is in said second position.
14. The multilayer circuit switch assembly of claim 13 , wherein a force moves said first layer from said second position to said first position.
15. The multilayer circuit switch assembly of claim 14 , wherein said first layer returns to said second position when said farce is removed.
16. A method of making electrical contact, said method comprising:
providing a first layer comprising opposed first and second surfaces, said first layer having a first conductive material disposed on said first surface thereof and a protrusion extending from said second surface thereof;
providing a second layer having a second conductive material disposed thereon;
providing a third layer disposed between said first and second layer, said third layer having an opening therein;
positioning said first layer proximate to said second layer, and applying force to said protrusion to force said first conductive material through said opening in said third layer to contact said second conductive material.