Method of fabricating thin film transistor
View Patent ↗A method of fabricating a thin film transistor including an electrically insulating substrate, a semiconductor layer formed on the substrate, and source and drain electrodes formed above source and drain regions formed in the semiconductor layer, the source and drain electrodes being composed of aluminum or aluminum alloy, the method including the steps of forming a gate electrode, implanting impurity ions into the semiconductor layer for forming the source and drain regions, forming an interlayer insulating film entirely over the substrate, forming contact holes throughout the interlayer insulating film such that the source and drain regions are exposed through the contact holes, forming an electrically conductive film composed of aluminum or aluminum alloy, in the contact holes for forming the source and drain electrodes, and thermally annealing the substrate at 275 to 350 degrees centigrade for 1.5 to 3 hours in inert atmosphere.
1. A method of fabricating a thin film transistor including an electrically insulating substrate, a semiconductor layer formed on said substrate, and source and drain electrodes formed above source and drain regions formed in said semiconductor layer, said source and drain electrodes being composed of aluminum or aluminum alloy,
said method comprising the steps of:
(a) forming a gate electrode electrically insulated from said semiconductor layer through a gate insulating film;
(b) implanting ions of impurity having a predetermined electrical conductivity, into at least a part of said semiconductor layer for forming said source and drain regions;
(c) forming an interlayer insulating film entirely over said substrate;
(d) forming contact holes throughout said interlayer insulating film such that at least a part of said source and drain regions is exposed through said contact holes;
(e) forming an electrically conductive film composed of aluminum or aluminum alloy, in said contact holes for forming said source and drain electrodes electrically connecting said source and drain regions through said contact holes; and
(f) immediately after said step (e), thermally annealing said substrate at 275 to 350 degrees centigrade for 1.5 to 3 hours in inert atmosphere.
2. The method as set forth in claim 1 , wherein said gate electrode is formed above said semiconductor layer in said step (a).
3. The method as set forth in claim 1 , wherein said gate electrode is formed below said semiconductor layer in said step (a).
4. The method as set forth in claim 1 , wherein said gate electrode is used as a mask in formation of said source and drain regions in said step (b).
5. The method as set forth in claim 1 , wherein said ions are implanted twice into said semiconductor layer in said step (b) in different impurity concentrations such that the resultant source and drain regions have a lightly-doped drain (LDD) structure.
6. The method as set forth in claim 1 , further comprising the step of (g) activating said semiconductor layer and applying hydrogen-plasma to said semiconductor layer, said step (g) being to be carried out between said steps (b) and (c).
7. The method as set forth in claim 1 , wherein said interlayer insulating film is formed in said step (c) so as to have a multi-layered structure.
8. The method as set forth in claim 1 , wherein said semiconductor layer is comprised of a polysilicon film.
9. The method as set forth in claim 1 , wherein said substrate is thermally annealed in said step (f) in a nitrogen, arson, neon or helium atmosphere.
10. A method of fabricating a thin film transistor including an electrically insulating substrate, a semiconductor layer formed on said substrate, and source and drain electrodes formed above source and drain regions formed in said semiconductor layer, said source and drain electrodes being composed of aluminum or aluminum alloy,
said method comprising the steps of:
(a) forming a gate electrode electrically insulated from said semiconductor layer through a gate insulating film;
(b) implanting ions of impurity having a predetermined electrical conductivity, into at least a part of said semiconductor layer for forming said source and drain regions;
(c) forming an interlayer insulating film entirely over said substrate;
(d) forming contact holes throughout said interlayer insulating film such that at least a part of said source and drain regions is exposed through said contact holes;
(e) forming an electrically conductive film composed of aluminum or aluminum alloy, in said contact holes for forming said source and drain electrodes electrically connecting said source and drain regions through said contact holes; and
(f) immediately after said step (e), thermally annealing said substrate in an inert atmosphere.
11. The method as set forth in claim 10 , wherein said annealing is performed at least 275 degrees centigrade.
12. The method as set forth in claim 10 , wherein said annealing is performed at 275 to 350 degrees centigrade.
13. The method as set forth in claim 10 , wherein said annealing is performed for at least 1.5 hours.
14. The method as set forth in claim 10 , wherein said annealing is performed for 1.5 to 3 hours.
15. The method as set forth in claim 10 , further comprising the step of (g) forming a pixel electrode which electrically connects said source electrode to said drain electrode, said step (g) being to be carried out after said step (f).
16. The method as set forth in claim 15 , further comprising the step of (h) forming a planarization film and a passivation film over the resultant device of claim 15 , said step (h) being to be carried out after said step (g).
17. The method as set forth in claim 10 , wherein said gate electrode is formed above said semiconductor layer in said step (a).
18. The method as set forth in claim 10 , wherein said gate electrode is formed below said semiconductor layer in said step (a).
19. The method as set forth in claim 10 , wherein said interlayer insulating film is formed in said step (c) so as to have a multi-layered structure.