Circuit board having segments with different signal speed characteristics
View Patent ↗A circuit board includes multiple segments, with a first segment having plural signal layers and a second segment having plural signal layers. Signal paths provided by signal layers of the first segment exhibit higher speed signal transmission capability than signal paths provided by the signal layers of the second segment.
1. A circuit board comprising:
a plurality of segments comprising first and second segments, the first segment including plural signal layers and at least one dielectric layer having a first dielectric constant, and the second segment including plural signal layers and at least one dielectric layer having a second dielectric constant, the first and second dielectric constants being different, and
wherein signal paths provided by the signal layers of the first segment exhibit higher speed signal transmission capability than signal paths provided by the signal layers of the second segments.
2. The circuit board of claim 1 , wherein the first segment includes plural dielectric layers having the first dielectric constant, and the second segment includes plural dielectric layers having the second dielectric constant.
3. The circuit board of claim 1 , wherein the plurality of segments further comprise a third segment having plural signal layers, and wherein the first segment is embedded between the second and third segments.
4. The circuit board of claim 3 , wherein the third segment further includes at least one dielectric layer having the second dielectric constant.
5. The circuit board of claim 3 , wherein the first segment further comprises buried vias that extend to the signal layers of the first segment but do not extend to signal layers of the second and third segments.
6. The circuit board of claim 5 , further comprising a through-hole via extending through the first, second, and third segments.
7. The circuit board of claim 1 , wherein the first segment is provided on one side of the second segment.
8. The circuit board of claim 1 , wherein the first segment further includes a reference plane layer, and a via passing through the reference plane layer and at least one signal layer, the first segment further comprising a first clearance defined around the via at the at least one signal layer, and a second clearance defined around the via at the reference plane layer, the second clearance being larger than the first clearance.
9. The circuit board of claim 8 , wherein the first segment further includes a second reference plane layer and the via extends through the second reference plane layer, the first segment further including a third clearance around the via at the second reference plane layer, the third clearance having generally the same size as the second clearance.
10. The circuit board of claim 1 , wherein the first segment has dielectric layers each with a first thickness, and the second segment has dielectric layers each with a second thickness, the first thickness being smaller than the second thickness.
11. The circuit board of claim 1 , wherein the plurality of segments further comprise a third segment having a plurality of signal layers, wherein the first segment is provided between the second and third segments, and wherein the second segment has an outer surface, the circuit board further comprising:
active devices mounted on the outer surface of the second segment; and
active devices provided between the first and second segments.
12. The circuit board of claim 1 , further comprising:
a first via extending through layers of the first segment but not into the second segment; and
a second via extending through layers of the first and second segments.