IP Library Granted Patent US 6,902,456
Granted Patent B2
US 6,902,456 · App. 10/643,608 · Granted Jun 7, 2005

Socket for use with a micro-component in a light-emitting panel

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,902,456
App. No.
10/643,608
Granted
Jun 7, 2005
Kind
B2
Abstract

An improved light-emitting panel having a plurality of micro-components at least partially disposed in a socket and sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes.

Claims (24)

1. A method for forming an emission unit for use in a light emitting panel comprising:

forming a first conductive layer of material on a substrate;

forming a second non-conductive layer of material on the first conductive layer of material;

forming a third conductive layer of material on the second non-conductive layer of material;

forming a fourth non-conductive layer of material on the third conductive layer of material;

removing portions of the first conductive layer, the second non-conductive layer, the third conductive layer and the fourth non-conductive layer, forming a cavity therein;

forming a fifth conductive layer in the cavity; and

inserting at least one micro-component into the cavity, wherein the micro-component is electrically contacted to the first conductive layer, the third conductive layer, and the fifth conductive layer.

2. The method according to claim 1 , further comprising coating the cavity with a sixth enhancement layer prior to inserting the at least one micro-component therein.

3. The method according to claim 1 , wherein the sixth enhancement layer is selected from the group consisting of an adhesive, a bonding agent, and a reflection filter.

4. The method according to claim 2 , further comprising forming a seventh transparent layer on the fourth conductive layer and the micro-component.

5. The method according to claim 1 , wherein the first conductive layer is a sustain electrode.

6. The method according to claim 1 , wherein the third conductive layer is an address electrode.

7. The method according to claim 1 , wherein the fifth conductive layer is a sustain electrode.

8. A method for forming an emission unit for use in a light emitting panel comprising:

forming a cavity in a substrate;

forming a first mechanically flexible conductive layer of material in the cavity;

forming a second mechanically flexible non-conductive layer of material on the first mechanically flexible conductive layer of material;

forming a third mechanically flexible conductive layer of material on the second mechanically flexible non-conductive layer of material;

forming a fourth mechanically flexible non-conductive layer of material on the third mechanically flexible conductive layer of material; and

inserting at least one micro-component into the cavity by flexing the first mechanically flexible conductive layer, the second mechanically flexible non-conductive layer, the third mechanically flexible conductive layer and the fourth mechanically flexible non-conductive layer.

9. The method according to claim 8 , wherein the first mechanically flexible conductive layer is an address electrode.

10. The method according to claim 8 , wherein the third mechanically flexible conductive layer is a sustain electrode.

11. The method according to claim 8 , wherein a fifth enhancement material layer is applied to the micro-component and is selected from the group consisting of an anti-glare coating, a touch sensitive surface, a contrast enhancement coating and a protective coating.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jan 17, 2020
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: LEIDOS, INC.
Reel/Frame 051632/0742 →
RELEASE OF SECURITY INTEREST Recorded Jan 17, 2020
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: LEIDOS, INC.
Reel/Frame 051632/0819 →
SECURITY INTEREST Recorded Aug 25, 2016
From: LEIDOS, INC.
To: CITIBANK, N.A.
Reel/Frame 039809/0801 →
SECURITY INTEREST Recorded Aug 25, 2016
From: LEIDOS, INC.
To: CITIBANK, N.A.
Reel/Frame 039818/0272 →
CHANGE OF NAME Recorded Apr 10, 2014
From: SCIENCE APPLICATIONS INTERNATIONAL CORPORATION
To: LEIDOS, INC.
Reel/Frame 032654/0381 →