IP Library Granted Patent US 6,969,879
Granted Patent B2
US 6,969,879 · App. 10/645,320 · Granted Nov 29, 2005

Solid state image sensor

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Quick Facts
Patent No.
US 6,969,879
App. No.
10/645,320
Granted
Nov 29, 2005
Kind
B2
Abstract

An active pixel image sensor is formed on a P-type epitaxial layer on a P-type substrate. An active pixel array is in the P-type epitaxial layer. Each pixel includes an N-well functioning as a collection node, and a P-well adjacent the N-well. The P-well includes only NMOS transistors functioning as active elements. The in-pixel transistors cooperate with off-pixel PMOS transistors to form A-D converters.

Claims (73)

1. A solid state image sensor comprising:

a substrate of a first conductivity type;

an epitaxial layer of the first conductivity type on said substrate;

an active pixel array in said epitaxial layer, each pixel comprising

a first well of a second conductivity type functioning as a collection node,

at least one second well of the first conductivity type adjacent said first well, and

a plurality of MOS transistors of only the second conductivity type functioning as active elements of said pixel; and

circuit elements external said active pixel array, said external circuit elements comprising a respective comparator and counter for each pixel.

2. A solid state image sensor according to claim 1 , wherein the first conductivity type comprises a P-type conductivity, and the second conductivity type comprises an N-type conductivity.

3. A solid state image sensor according to claim 1 , wherein the first conductivity type comprises an N-type conductivity, and the second conductivity type comprises a P-type conductivity.

4. A solid state image sensor according to claim 1 , and wherein said active elements in each pixel and said external circuit elements form part of an analog-to-digital converter.

5. A solid state image sensor according to claim 4 , wherein said active elements in each pixel form an amplifier connected to said comparator for forming part of the analog-to-digital converter.

6. A solid state image sensor according to claim 5 , wherein said active elements in each pixel are selectively switched to said comparator.

7. A solid state image sensor according to claim 5 , wherein said circuit elements external each pixel comprise at least one current mirror connected to said comparator; and wherein said active elements in each pixel form a differential amplifier for receiving a pixel photodiode voltage and a reference voltage, and for providing a balanced output to said at least one current mirror connected thereto.

8. A solid state image sensor according to claim 7 , wherein the reference voltage is ramped during a time when each pixel is integrating a photo induced current.

9. A solid state image sensor according to claim 7 , wherein the reference voltage is ramped during reset of each pixel to provide an offset compensation.

10. A solid state image sensor according to claim 5 , further comprising a latch connected to said at least one comparator in which a count is latched by a change of state of said at least one comparator.

11. A solid state image sensor according to claim 10 , further comprising a frame store circuit connected to said latch for receiving the count latched by said latch.

12. A solid state image sensor comprising:

a substrate of a first conductivity type;

an epitaxial layer of the first conductivity type on said substrate;

an active pixel array in said epitaxial layer, each pixel comprising

a first well of a second conductivity type functioning as a collection node,

at least one second well of the first conductivity type adjacent said first well, and

a plurality of MOS transistors of only the second conductivity type functioning as active elements of said pixel; and

circuit elements external said active pixel array, said external circuit elements comprising comparators and counters, and wherein a number of pixels in a given row or column of said active pixel array share a single comparator and counter, with the corresponding pixels in the given row or column being enabled sequentially.

13. A solid state image sensor according to claim 12 , wherein said active elements in each pixel form a differential amplifier, and outputs of said differential amplifier are multiplexed to a pair of output lines common to the corresponding pixels in the given row or column.

14. A solid state image sensor according to claim 13 , wherein the active elements in each pixel further comprise cascode transistors connected to the outputs of each differential amplifier.

15. A solid state image sensor comprising:

a substrate;

an active pixel array in said substrate, each pixel comprising

a first well of a first conductivity type functioning as a collection node,

at least one second well of a second conductivity type adjacent said first well, and

a plurality of MOS transistors of only the first conductivity type functioning as active elements; and

circuit elements in said substrate and external said active pixel array and forming analog-to-digital converters with the active elements therein, the external circuit elements further comprising a respective comparator and counter for each pixel.

16. A solid state image sensor according to claim 15 , wherein said substrate is of the second conductivity type; and wherein the first conductivity type comprises a P-type conductivity and the second conductivity type comprises an N-type conductivity.

17. A solid state image sensor according to claim 15 , wherein said substrate is of the first conductivity type; and wherein the first conductivity type comprises a N-type conductivity and the second conductivity type comprises a P-type conductivity.

18. A solid state image sensor according to claim 15 , wherein said active elements in each pixel form an amplifier connected to said comparator for forming an analog-to-digital converter.

19. A solid state image sensor according to claim 18 , wherein said active elements in each pixel are selectively switched to said comparator.

20. A solid state image sensor according to claim 18 , wherein said circuit elements external each pixel comprise at least one current mirror connected to said at least one comparator; and wherein said active elements in each pixel form a differential amplifier for receiving a pixel photodiode voltage and a reference voltage, and for providing a balanced output to said at least one current mirror connected thereto.

21. A solid state image sensor according to claim 20 , wherein the reference voltage is ramped during a time when each pixel is integrating a photo induced current.

22. A solid state image sensor according to claim 20 , wherein the reference voltage is ramped during reset of each pixel to provide an offset compensation.

23. A solid state image sensor according to claim 18 , further comprising a latch connected to said comparator in which a count is latched by a change of state of said at least one comparator.

24. A solid state image sensor according to claim 23 , further comprising a frame store circuit connected to said latch for receiving the count latched by said latch.

25. A solid state image sensor comprising:

a substrate;

an active pixel array in said substrate, each pixel comprising

a first well of a first conductivity type functioning as a collection node,

at least one second well of a second conductivity type adjacent said first well, and

a plurality of MOS transistors of only the first conductivity type functioning as active elements; and

circuit elements in said substrate and external said active pixel array and forming analogtodigital converters with the active elements therein;

wherein said circuit elements external each pixel further comprise comparators and counters for said active pixel array, and wherein a number of pixels in a given row or column of said active pixel array share a single comparator and counter, with the pixels being enabled sequentially.

26. A solid state image sensor according to claim 25 , wherein said active elements in each pixel form a differential amplifier, and outputs of said differential amplifier are multiplexed to a pair of output lines common to the corresponding pixels in the given row or column.

27. A solid state image sensor according to claim 26 , wherein the active elements in each pixel further comprise cascode transistors connected to the outputs of each differential amplifier.

28. A method for making a solid state image sensor comprising:

forming an active pixel array in a substrate, and forming each pixel comprising

forming a first well of a first conductivity type functioning as a collection node,

forming at least one second well of a second conductivity type adjacent the first well,

forming a plurality of MOS transistors of only the first conductivl,ty type functioning as active elements; and

forming circuit elements in the substrate external the active pixel array and forming analog-to-digital converters with the active elements therein;

wherein the circuit elements external each pixel further comprise a respective comparator and counter for each pixel.

29. A method according to claim 28 , wherein the active elements in each pixel form an amplifier connected to the at least one comparator for forming an analog-to-digital converter.

30. A method according to claim 29 , wherein the active elements in each pixel are selectively switched to the comparator.

31. A method according to claim 29 , wherein the circuit elements external each pixel comprise at least one current mirror connected to the comparator; and wherein the active elements in each pixel form a differential amplifier for receiving a pixel photodiode voltage and a reference voltage, and for providing a balanced output to the at least one current mirror connected thereto.

32. A method according to claim 29 , further comprising a latch connected to the comparator in which a count is latched by a change of state of the comparator.

33. A method according to claim 32 , further comprising a frame store circuit connected to the latch for receiving the count latched by the latch.

34. A method for making a solid state image sensor comprising:

forming an active pixel array in a substrate, and forming each pixel comprising

forming a first well of a first conductivity type functioning as a collection node,

forming at least one second well of a second conductivity type adjacent the first well,

forming a plurality of MOS transistors of only the first conductivity type functioning as active elements; and

forming circuit elements in the substrate external the active pixel array and forming analog-to digital converters with the active elements therein, wherein the circuit elements external each pixel further comprise comparators and counters far the active pixel array, and wherein a number of pixels in a given row or column of the active pixel array share a single comparator and counter, with the pixels being enabled sequentially.

35. A method according to claim 34 , wherein the active elements in each pixel form a differential amplifier, and outputs of the differential amplifier are multiplexed to a pair of output lines common to the corresponding pixels in the given row or coluxnn.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2016
From: STMICROELECTRONICS LIMITED
To: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED
Reel/Frame 038847/0890 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2004
From: RAYNOR, JEFF
To: STMICROELECTRONICS LTD.
Reel/Frame 015031/0665 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2004
From: RAYNOR, JEFF
To: STMICROELECTORNICS LTD.
Reel/Frame 014881/0924 →