IP Library Granted Patent US 7,679,096
Granted Patent B1
US 7,679,096 · App. 10/645,474 · Granted Mar 16, 2010

Integrated LED heat sink

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Quick Facts
Patent No.
US 7,679,096
App. No.
10/645,474
Granted
Mar 16, 2010
Kind
B1
Abstract

A heat sink for use with a high output LED light source is disclosed. The heat sink is used with an LED and conical reflector. The heat sink has a cylindrical back end holding the light emitting diode. The heat sink includes a conically shaped wall having an inner and outer surface and an open front end. The open front end has a rim with notches. The reflector has a front flat surface with arms which are fixed in the notches with a fastener. The heat sink includes a plurality of slits formed on the inner and outer surfaces extending between the back and front ends. A plurality of vanes extend radially from the inner surface. The heat sink is fabricated from a thermally conductive material. The conical shape of the heat sink, the slits and vanes increases exposed surface area to assist in dissipating heat generated from the LED.

Claims (15)

1. A heat sink for use in conjunction with a light emitting diode light source, the heat sink comprising:

a base member having electrical connections;

a wall having a conically shaped portion, the conically shaped portion of the wall having an outer surface, an inner surface, a back end having a mounting aperture for a light emitting diode, an opposite open front end, and a plurality of slits through the conically shaped portion; and

a plurality of vanes extending radially inward from the inner surface.

2. The heat sink of claim 1 wherein the wall and base member are fabricated from a highly thermally conductive material.

3. The heat sink of claim 2 wherein the highly thermally conductive material is aluminum.

4. The heat sink of claim 1 wherein the front end includes a circular rim having a plurality of notches for the mounting of arms attached to a reflector.

5. A heat sink for use in conjunction with a light emitting diode light source, the heat sink comprising:

a wall having a conically shaped portion, the conically shaped portion having an open front end, a back end opposite the front end and a plurality of slits through the conically shaped portion, wherein the wall is fabricated of a highly thermally conductive material; and

a rectangular box-shaped base member, held by the back end and adapted so that a substrate plate including a light emitting diode may be attached to the base member.

6. The heat sink of claim 5 , wherein the highly thermally conductive material is aluminum.

7. The heat sink of claim 5 , further comprising a plurality of vanes extending radially inward from an inner surface of the wall.

8. The heat sink of claim 5 wherein the front end includes a circular rim having a plurality of notches.

9. The heat sink of claim 5 further comprising a clear reflector placed over the light emitting diode.

10. The heat sink of claim 5 , wherein the base includes two depressions on opposite sides of the base running the full width of the base, parallel to the plane established by the open front end.

Assignments (10)
RELEASE OF FIRST LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 061161/0607 →
RELEASE OF SECOND LIEN SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Aug 12, 2022
From: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 061161/0685 →
SECOND LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Dec 5, 2017
From: EXCELITAS TECHNOLOGIES CORP.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 044695/0780 →
FIRST LIEN INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Dec 5, 2017
From: EXCELITAS TECHNOLOGIES CORP.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 044695/0525 →
RELEASE OF SECURITY INTEREST Recorded Dec 1, 2017
From: CORTLAND PRODUCTS CORP.
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 044591/0966 →
RELEASE OF FIRST LIEN SECURITY INTEREST IN PATENTS RECORDED AT REEL 031558/FRAME 0873 Recorded Dec 1, 2017
From: UBS AG, STAMFORD BRANCH
To: EXCELITAS TECHNOLOGIES CORP.
Reel/Frame 044621/0082 →
ASSIGNMENT OF SECURITY INTEREST IN PATENTS SECOND LIEN Recorded Sep 15, 2016
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS EXISTING AGENT
To: CORTLAND PRODUCTS CORP., AS SUCCESSOR AGENT
Reel/Frame 040043/0135 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Jan 17, 2014
From: EXCELITAS TECHNOLOGIES CORP.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 032086/0605 →
RELEASE OF PATENT SECURITY AGREEMENT RECORDED AT REEL 025814/FRAME 0276 Recorded Nov 12, 2013
From: UBS AG, STAMFORD BRANCH
To: EXCELITAS TECHNOLOGIES CORP. (SUCCESSOR-IN-INTEREST TO PERKINELMER SENSORS, INC., PERKINELMER ILLUMINATION, INC. AND PERKINELMER LED SOLUTIONS, INC.)
Reel/Frame 031626/0852 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Nov 3, 2013
From: EXCELITAS TECHNOLOGIES CORP.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 031558/0873 →