Foldable electronic device
View Patent ↗The invention provides a foldable electronic device comprising a main body and a closure connected to each other openably. A frame 6 is provided inside the closure and holds therein a main display 4 and a subdisplay 5 as arranged back to back. A chip mount area 42 of a flexible lead 41 extending from the main display 4 and a chip mount area 53 of a flexible lead 51 extending from the subdisplay 5 are opposed to each other in an opening formed in the frame 6. Opposed surfaces of the respective chip mount areas 42, 53 have groups of electronic circuit chips 43, 54 mounted thereon as positioned in a staggered relation with each other.
1. A foldable electronic device comprising:
a main body ( 1 ),
a closure ( 2 ),
a main display ( 4 ),
a subdisplay ( 5 ),
a frame ( 6 ),
a chip mount area ( 42 ) of a flexible lead ( 41 ) extending from the main display ( 4 ), and
a chip mount area ( 53 ) of a flexible lead ( 51 ) extending from the subdisplay ( 5 ),
the main body and the closure being connected to each other openably, the main display having a screen exposed from an inner surface of the closure ( 2 ), the subdisplay ( 5 ) having a screen exposed from a back surface of the closure ( 2 ), the frame ( 6 ) being provided inside the closure ( 2 ) and holding therein the main display ( 4 ) and the subdisplay ( 5 ) as arranged back to back, the chip mount area ( 42 ) and the chip mount area ( 53 ) being opposed to each other in an opening formed by the frame ( 6 ), the opposed surfaces of the respective chip mount areas ( 42 )( 53 ) having at least one portion with a group of electronic circuit chips ( 43 )( 54 ) mounted thereon and at least one portion free of a group of electronic circuit chips,
wherein the at least one portion of the chip mount area ( 42 ) of the flexible lead ( 41 ) having a group of electronic circuit chips ( 43 ) opposes the at least one portion of the chip mount area ( 53 ) free of a group of electronic circuit chips,
the at least one portion of the chip mount area ( 53 ) of the flexible lead ( 51 ) having a group of electronic circuit chips ( 54 ) opposes the at least one portion of the chip mount area ( 42 ) free of a group of electronic circuit chips, and
the flexible lead ( 51 ) extending from the subdisplay ( 5 ) has an outer end portion folded over toward the frame ( 6 ) side, and the folded-over portion has a surface opposed to the frame ( 6 ) and providing the chip mount area ( 53 ),
wherein the frame ( 6 ) has said opening in a second area thereof adjacent to a first area thereof covered with the subdisplay ( 5 ), and the flexible lead ( 51 ) extending from the subdisplay ( 5 ) is folded over on the second area,
wherein the flexible lead ( 41 ) extending from the main display ( 4 ) is folded over toward the frame ( 6 ) side, and the folded-over lead portion has a surface opposed to the frame ( 6 ) and providing the chip mount area ( 42 ),
wherein the electronic circuit chips ( 54 ) in the chip mount area ( 53 ) of the flexible lead ( 51 ) extending from the subdisplay ( 5 ) and the electronic circuit chips ( 43 ) in the chip mount area ( 42 ) of the flexible lead ( 41 ) extending from the main display ( 4 ) are positioned in a staggered meshing relation within said opening formed by frame ( 6 ),
wherein frame ( 6 ) is disposed between flexible lead ( 41 ) and flexible lead ( 51 ) with electronic circuit chips ( 54 ) and electronic circuit chips ( 43 ) extending through said opening formed by frame ( 6 ) to mesh absent any component of said foldable electronic device arranged between said electronic circuit chips ( 54 ) and said electronic circuit chips ( 43 ), and
wherein a plane defined by frame ( 6 ) corresponding to said opening formed by frame ( 6 ) intersects at least one of electronic chips ( 54 ) and at least one of electronic chips ( 43 ).