Connector assembly with decoupling capacitors
View Patent ↗A connector assembly is disclosed and claimed. The connector assembly includes a connector and a cable attachable at one end to the connector. The cable includes a first conductive layer and a second conductive layer disposed over the first conductive layer. A layer of insulation material is disposed at least between the first conductive layer and the second conductive layer and a plurality of capacitors are connected between the first conductive layer and the second conductive layer.
1. A method of making a connector assembly, comprising:
forming a cable receiver operable to attach a cable to the connector assembly, the cable including a first conductive layer disposed over a second conductive layer to define the cable, wherein the first conductive layer is insulated from the second conductive layer;
forming a first terminal of a connector plug operable to attach to the first conductive layer of the cable;
forming a second terminal of the connector plug operable to attach to the second conductive layer of the cable; and
connecting a plurality of capacitors between the first and second terminals within the connector assembly.
2. The method of claim 1 , wherein connecting the plurality of capacitors comprises:
removing a portion of the insulation material from the first conductive layer of an attached cable within the connector assembly according to a predetermined pattern to expose at least a portion of the first conductive layer;
forming openings through the first conductive layer of the attached cable according to another predetermined pattern;
removing a portion of the insulation material covering the second conductive layer of the attached cable according to the other predetermined pattern to expose at least a portion of the second conductive layer through the opening in the first conductive layer and insulation material;
connecting one terminal of each capacitor to the exposed first conductive layer; and
connecting another terminal of each capacitor to the exposed second conductive layer.
3. The method of claim 1 , wherein the first conductive layer, the second conductive layer and the layer of insulation material are flexible.
4. The method of claim 1 , further comprising coating the first and second conductive layers with mylar.
5. The method of claim 1 , further comprising selecting a quantity of the plurality of capacitors and a size of each of the plurality of capacitors to provide a predetermined reduction in equivalent series resistance, voltage droop and settling time.
6. The method of claim 1 , further comprising formation of connection elements operable to couple the connector assembly to an integrated circuit.
7. The method of claim 6 , further comprising formation of a self-aligning suspension system operable to receive the integrated circuit.
8. The method of claim 6 , further comprising forming a frame element operable to support the integrated circuit.