SMT LED indicator package
View Patent ↗A temperature resistant waveguide is mounted to an SMT LED package to provide a complete module that can withstand temperatures found in a solder reflow process without deformation or damage. The waveguide is composed of a high temperature thermoplastic and is coupled to the LED using automated equipment with optical markings for precise positioning and construction. The SMT LED module is automatically located on a printed circuit board and exposed to temperatures for a solder reflow process. The high temperature thermoplastic does not deform during the solder reflow process, thereby providing a robust SMT LED module that can be automatically manufactured and placed on a printed circuit board, without additional steps or human intervention.
1. An SMT LED device, comprising:
a substrate having circuit traces to provide connections for the LED, and for mounting the LED;
solder pads on a first side of the substrate and coupled to the circuit traces for providing external connections with the LED;
an LED die mounted on a second surface of the substrate and coupled to the circuit traces;
an optical waveguide mounted on the second surface of the substrate and coupled to the LED die to direct light from the LED die in a specified direction;
positioning indicia on at least one of the waveguide and the substrate; and
the waveguide being composed of a material resistant to deformation in the presence of temperatures found in a solder reflow process.
2. The LED according to claim 1 , further comprising a light projection surface on a portion of the waveguide to which light is directed.
3. An SMT LED device, comprising:
a substrate having circuit traces to provide connections for the LED, and for mounting the LED;
solder pads on a first side of the substrate and coupled to the circuit traces for providing external connections with the LED;
an LED die mounted on a second surface of the substrate and coupled to the circuit traces;
an optical wave guide mounted on the second surface of the substrate and coupled to the LED die to direct light from the LED die in a specified direction;
positioning indicia on at least one of the waveguide and the substrate;
the waveguide being composed of a material resistant to deformation in the presence of temperatures found in a solder reflow process; and
a guide structure on a portion of the waveguide for locating the LED on a printed circuit board with automated machinery.
4. The LED according to claim 1 , further comprising a total internal reflective contour on a portion of the waveguide for directing the light from the LED die in the specified direction.
5. The LED according to claim 1 , wherein the waveguide material is transparent.
6. The LED according to claim 1 , wherein the waveguide material is a high temperature thermoplastic.