System for cooling multiple logic molecules
View Patent ↗An exemplary embodiment is a cooling system for cooling multiple logic modules. The cooling system includes a condenser, a first electrically controlled expansion valve coupled to the condenser and a first evaporator coupled to the first electrically controlled expansion valve. A second electrically controlled expansion valve is coupled to the condenser and a second evaporator coupled to the second electrically controlled expansion valve. A controller provides control signals to the first electrically controlled expansion valve and the second electrically controlled expansion valve to control operation of the first electrically controlled expansion valve and the second electrically controlled expansion valve. A compressor is coupled to the first evaporator, the second evaporator and the condenser.
1. A cooling system for cooling multiple logic modules, the cooling system comprising:
a condenser;
a first electrically controlled expansion valve coupled to said condenser;
a first evaporator coupled to said first electrically controlled expansion valve;
a second electrically controlled expansion valve coupled to said condenser;
a second evaporator coupled to said second electrically controlled expansion valve;
a controller providing control signals to said first electrically controlled expansion valve and said second electrically controlled expansion valve to control operation of said first electrically controlled expansion valve and said second electrically controlled expansion valve;
a compressor coupled to said first evaporator, said second evaporator and said condenser.
2. The cooling system of claim 1 wherein:
said controller controls refrigerant flow and pressure drop in said first electrically controlled expansion valve and said second electrically controlled expansion valve.
3. The cooling system of claim 1 further comprising:
at least one temperature sensor providing a temperature signal to said controller, said controller generating said control signals in response to said temperature signal.
4. The cooling system of claim 3 wherein:
said at least one temperature sensor includes a plurality of temperature sensors.
5. The cooling system of claim 4 wherein:
said plurality of temperatures sensors include a first temperature sensor providing a temperature signal indicative of temperature at one logic module and a second temperature sensor providing a temperature signal indicative of refrigerant temperature.
6. The cooling system of claim 1 further comprising:
a first secondary expansion valve coupled between said first electrically controlled expansion valve and said first evaporator.
7. The cooling system of claim 6 further comprising:
a second secondary expansion valve coupled between said second electrically controlled expansion valve and said second evaporator.
8. The cooling system of claim 6 wherein:
said condenser, said first electrically controlled expansion valve, said second electrically controlled expansion valve, said compressor and said controller are contained within a modular refrigeration unit, and
said first secondary expansion valve is positioned proximate to said first evaporator.
9. The cooling system of claim 1 wherein:
said first electrically controlled expansion valve includes a stepper motor that opens or closes an orifice in response to said control signals.