IP Library › Granted Patent US 7,173,076
Granted Patent B2
US 7,173,076 · App. 10/654,167 · Granted Feb 6, 2007

Composition and method relating to a hot melt adhesive

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Quick Facts
Patent No.
US 7,173,076
App. No.
10/654,167
Granted
Feb 6, 2007
Kind
B2
Abstract

The present invention includes methods and compositions relating to a hot melt adhesive that includes ethylene methyl methacrylate and a tackifying resin.

Claims (25)

1. A hot melt adhesive composition comprising:

(a) an ethylene methyl methacrylate copolymer having a peak melting point of no greater than about 67° C.±6° C.;

(b) a wax; and

(c) a tackifying resin,

with the proviso that the composition does not include a surfactant or a copolymer of ethylene and n-butyl acrylate.

2. The composition of claim 1 further comprising an oil.

3. The composition of claim 1 further comprising an antioxidant.

4. The composition of claim 1 further comprising a copolymer.

5. The composition of claim 1 further comprising a block copolymer.

6. A package formulation comprising:

(a) the composition of claim 1 ; and

(b) instructions for application of the composition to a substrate.

7. A hot melt adhesive composition consisting essentially of:

(a) an autoclave reactor ethylene methyl methacrylate copolymer;

(b) a wax; and

(c) a tackifying resin.

8. The composition of claim 7 further consisting essentially of an oil.

9. The composition of claim 7 further consisting essentially of an antioxidant.

10. The composition of claim 7 further consisting essentially of a block copolymer.

11. A method of using a hot melt adhesive composition comprising:

(a) providing a hot melt adhesive composition comprising:

(i) an ethylene methyl methacrylate copolymer having a peak melting point of no greater than about 67° C.±6° C.; and

(ii) a tackifying resin, with the proviso that the composition does not include a surfactant or a copolymer of ethylene and n-butyl acrylate; and

(b) applying the composition to a substrate.

12. The method of claim 11 wherein the method is a method of using the hot melt adhesive for book binding.

Assignments (5)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS (TERM LOAN) Recorded Feb 15, 2023
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: H.B. FULLER COMPANY; H.B. FULLER CONSTRUCTION PRODUCTS INC.; ROYAL ADHESIVES AND SEALANTS, LLC; ADCO PRODUCTS, LLC
Reel/Frame 062761/0884 →
TERM LOAN SECURITY AGREEMENT Recorded Oct 25, 2017
From: H.B. FULLER COMPANY; H.B. FULLER CONSTRUCTION PRODUCTS INC.; ROYAL ADHESIVES AND SEALANTS, LLC; ADCO PRODUCTS, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 044616/0671 →
RCF SECURITY AGREEMENT Recorded Oct 25, 2017
From: H.B. FULLER COMPANY; H.B. FULLER CONSTRUCTION PRODUCTS INC.; ROYAL ADHESIVES AND SEALANTS, LLC; ADCO PRODUCTS, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 044616/0700 →
CHANGE OF NAME Recorded Nov 30, 2009
From: H.B. FULLER LICENSING & FINANCING, INC.
To: H.B. FULLER COMPANY
Reel/Frame 023574/0530 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2004
From: ALBRECHT, STEVEN W.; SUZUKI, KAZUYA; MALCOLM, DAVID B.; ROSKA, TIMOTHY W.; COLEMAN, KATHRYN A.
To: H.B. FULLER LICENSING & FINANCING, INC.
Reel/Frame 014917/0652 →