IP Library › Granted Patent US 7,019,367
Granted Patent B2
US 7,019,367 · App. 10/655,640 · Granted Mar 28, 2006

Integrated circuit

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Quick Facts
Patent No.
US 7,019,367
App. No.
10/655,640
Granted
Mar 28, 2006
Kind
B2
Abstract

An integrated circuit is disclosed herein. One embodiment of the integrated circuit comprises a power supply conductor, a circuit, at least one bypass capacitor, and an electrostatic protection circuit. The circuit may be located on a first piece of silicon, which may be located on a first insulator. The bypass capacitor may be located on a second piece of silicon, which may be located on second insulator. The electrostatic protection circuit may be located on a third piece of silicon, which may be located on a third insulator. The electrostatic protection circuit is connected to the power supply conductor by way of a first line. The bypass capacitor and the circuit are connected to the power supply conductor by way of a second line. The resistance of the second line is greater than the resistance of the first line.

Claims (35)

1. An integrated circuit comprising:

a power supply conductor;

at least one circuit located on a first piece of silicon, said first piece of silicon located on a first insulator;

at least one bypass capacitor circuit located on a second piece of silicon, said second piece of silicon located on a second insulator; and

at least one electrostatic protection circuit located on a third piece of silicon, said third piece of silicon located on a third insulator;

said at least one electrostatic protection circuit connected to said power supply conductor by way of a first line; and

said at least one bypass capacitor circuit and said at least one circuit being connected to said power supply conductor by way of a second line, the resistance of said second line being greater than the resistance of said first line.

2. The circuit of claim 1 , wherein said at least one circuit is an input/output device.

3. The circuit of claim 1 , wherein said second line is located between said power supply conductor and said first insulator.

4. The circuit of claim 1 , wherein at least one portion of said second line comprises a diffusion.

5. The circuit of claim 1 , wherein at least one portion of said second line is adjacent said first insulator.

6. The circuit of claim 1 , wherein at least a portion of said second line comprises a resistor.

7. The circuit of claim 6 , wherein said resistor is adjacent said first insulator.

8. The circuit of claim 1 , wherein said second line comprises a plurality of resistors connected in parallel to one another.

9. An integrated circuit comprising:

a power supply conductor;

an input/output circuit located on a first piece of silicon, said first piece of silicon located on a first insulator;

at least one bypass capacitor circuit located on a second piece of silicon, said second piece of silicon located on a second insulator; and

at least one electrostatic protection circuit located on a third piece of silicon, said third piece of silicon located on a third insulator;

said at least one electrostatic protection circuit connected to said power supply conductor by way of a first line; and

said at least one bypass capacitor circuit and said unput/output circuit being connected to said power supply conductor by way of a second line, said second line comprising a plurality of resistors, wherein the resistance of said second line is greater than the resistance of said first line.

10. An integrated circuit comprising:

a power supply means;

at least one circuit located on a first piece of silicon, said first piece of silicon located on a first insulator;

at least one bypass capacitor circuit located on a second piece of silicon, said second piece of silicon located on a second insulator; and

at least one electrostatic protection means located on a third piece of silicon, said third piece of silicon located on a third insulator;

said at least one electrostatic protection means connected to said power supply means by way of a first conducting means; and

said at least one bypass capacitor circuit and said at least one circuit being connected to said power supply conductor by way of a second conducting means, the resistance of said second conducting means being greater than the resistance of said first conducting means.

11. The circuit of claim 10 , wherein said at least one circuit is an input/output device.

12. The circuit of claim 10 , wherein at least a portion of said second conductive means is located between said power supply means and said first insulator.

13. The circuit of claim 10 , wherein at least one portion of said second conductive means comprises a diffusion.

14. The circuit of claim 10 , wherein at least one portion of said second conductive means is adjacent said first insulator.

15. The circuit of claim 10 , wherein at least a portion of said second conductive means comprises a resistor.

16. The circuit of claim 15 , wherein said resistor is adjacent said first insulator.

17. The circuit of claim 10 , wherein said second conductive means comprises a plurality of resistors connected in parallel to one another.

Assignments (1)
SECURITY AGREEMENT Recorded Jul 30, 2024
From: LTI HOLDINGS, INC.; THE DURBIN GROUP, LLC
To: ROYAL BANK OF CANADA, AS FIRST LIEN AGENT
Reel/Frame 068193/0209 →