Methods for mastering microstructures through a substrate using negative photoresist
View Patent ↗Microstructures are fabricated by impinging a radiation beam, such as a laser beam, through a substrate that is transparent to the laser beam, into a negative photoresist layer on the substrate. The negative photoresist layer may be subsequently developed to provide a master for optical and/or mechanical microstructures. Related systems, microstructure products and microstructure masters also are disclosed.
1. A method of fabricating an array of microlenses comprising:
scanning a radiation beam at varying amplitude through a substrate that is transparent thereto into a negative photoresist layer on the substrate to image the array of microlenses in the negative photoresist layer.
2. A method according to claim 1 wherein the negative photoresist layer is thicker than the array of microlenses and wherein scanning comprises scanning a radiation beam at varying amplitude through a substrate that is transparent thereto into a negative photoresist layer on the substrate to image a buried array of microlenses in the negative photoresist layer, adjacent the substrate.
3. A method according to claim 1 wherein at least some of the microlenses include a base and a top that is narrower than the base and wherein scanning comprises scanning a radiation beam at varying amplitude through a substrate that is transparent thereto into a negative photoresist layer on the substrate to image the array of microlenses in the negative photoresist layer with the bases adjacent the substrate and the tops remote from the substrate.
4. A method according to claim 1 wherein the negative photoresist layer is of variable thickness thereacross, wherein a minimum thickness of the negative photoresist layer is thicker than the microlenses and wherein scanning comprises scanning a radiation beam at varying amplitude through a substrate that is transparent thereto into a negative photoresist layer on the substrate to image buried microlenses beneath the negative photoresist layer, adjacent the substrate, that are independent of the variable thickness of the negative photoresist layer.
5. A method according to claim 1 wherein the negative photoresist layer includes impurities thereon, remote from the substrate, wherein the negative photoresist layer is thicker than the microlenses and wherein scanning comprises scanning a radiation beam at varying amplitude through a substrate that is transparent thereto into a negative photoresist layer on the substrate to image buried microlenses in the negative photoresist layer, adjacent the substrate, that are not distorted by the impurities.
6. A method according to claim 1 wherein the substrate is a flexible substrate.
7. A method according to claim 1 wherein the negative photoresist layer is on a cylindrical platform such that the substrate is on the negative photoresist layer remote from the cylindrical platform, and wherein scanning comprises:
rotating the cylindrical platform about an axis thereof while simultaneously axially rastering the radiation beam at varying amplitude through the substrate that is on the cylindrical platform across at least a portion of the negative photoresist layer to image the array of microlenses in the negative photoresist layer.
8. A method according to claim 7 further comprising simultaneously translating the cylindrical platform and/or radiation beam axially relative to one another.
9. A method according to claim 8 further comprising simultaneously continuously varying the amplitude of the radiation beam.
10. A method according to claim 1 wherein the substrate is at least about one square foot in area.
11. A method according to claim 1 wherein scanning is performed continuously on the substrate for at least about 1 hour.
12. A method according to claim 1 wherein scanning is performed continuously on the substrate for at least about 1 hour to fabricate at least about one million microlenses.
13. A method according to claim 1 further comprising:
developing the microstructures that are imaged in the negative photoresist layer to provide a microlens array master.
14. A method according to claim 13 further comprising:
forming a plurality of second generation stampers directly from the master; and
forming a plurality of third generation microlens array end products directly from a stamper.
15. A method according to claim 1 wherein the substrate is cylindrical, ellipsoidal or polygonal in shape.
16. A method according to claim 1 further comprising translating the substrate and/or radiation beam relative to one another while scanning the radiation beam.