IP Library Patent Application 10664169
Patent Application Utility
App. No. 10/664,169 · Confirmation No. 3335

Product and process for bonding porous materials to substrates

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2006-05-12 ABN Abandonment 2 View
2005-09-09 CTFR Final Rejection 6 View
2005-09-09 892 List of references cited by examiner 1 View
2005-09-09 SRFW Search information including classification, databases and other search related notes 1 View
2005-09-09 FWCLM Index of Claims 1 View
2005-09-01 SRNT Examiner's search strategy and results 6 View
2005-07-13 WFEE Fee Worksheet (SB06) 1 View
2005-06-29 A... Amendment/Request for Reconsideration-After Non-Final Rejection 3 View
2005-06-29 SPEC Specification 3 View
2005-06-29 CLM Claims 4 View
2005-06-29 REM Applicant Arguments/Remarks Made in an Amendment 3 View
2005-03-29 CTNF Non-Final Rejection 7 View
2005-03-29 1449 List of References cited by applicant and considered by examiner 1 View
2005-03-29 892 List of references cited by examiner 1 View
2005-03-29 FWCLM Index of Claims 1 View
2005-03-29 SRFW Search information including classification, databases and other search related notes 1 View
2005-03-24 SRNT Examiner's search strategy and results 1 View
2004-10-28 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2004-10-28 FOR Foreign Reference 80 View
2004-10-28 FOR Foreign Reference 36 View
2003-09-16 TRNA Transmittal of New Application 3 View
2003-09-16 SPEC Specification 33 View
2003-09-16 CLM Claims 2 View
2003-09-16 ABST Abstract 1 View
2003-09-16 DRW Drawings-only black and white line drawings 11 View
2003-09-16 OATH Oath or Declaration filed 2 View
2003-09-16 WFEE Fee Worksheet (SB06) 1 View
2003-09-16 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/664,169
Filed
2003-09-16
Pub. No.
US20040115396A1
Examiner
VO, HAI
Art Unit
1771