IP Library Granted Patent US 6,969,313
Granted Patent B2
US 6,969,313 · App. 10/666,701 · Granted Nov 29, 2005

Cast diamond tools and formation thereof by chemical vapor deposition

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Quick Facts
Patent No.
US 6,969,313
App. No.
10/666,701
Granted
Nov 29, 2005
Kind
B2
Abstract

The present invention provides diamond tools, and a method for the formation thereof, using CVD techniques. In one aspect, an ephemeral mold is provided which has a diamond interface surface configured to inversely correspond to the desired shape for the working surface of a diamond layer in a tool. After the mold is provided, various CVD techniques may be used to deposit diamond layers upon the diamond interface surface of the mold. Following diamond deposition upon the diamond interface surface, the mold may be removed by various means, such as chemical etching, etc. Thus, the working surface of the diamond receives a shape which inversely corresponds to the configuration of the mold's diamond interface surface. The diamond mass may then be incorporated into a tool, if such incorporation has not yet taken place.

Claims (23)

1. A diamond tool formed by the process comprising the steps of:

a) providing a mold having a diamond interface surface configuration which inversely corresponds to a desired shape for a working surface of the tool;

b) coating said diamond interface surface with diamond using a chemical vapor deposition technique to form a diamond layer;

c) separating the mold from the diamond layer such that the resultant diamond layer has a working surface which inversely corresponds to the diamond interface surface configuration of the mold and a growth surface opposite the working surface; and

d) forming a tool body against at least a portion of the growth surface of the diamond layer.

2. The diamond tool of claim 1 , wherein said mold comprises a metal material.

3. The diamond tool of claim 2 , wherein said metal material is a member selected from the group consisting of tungsten, molybdenum, tantalum, zirconium, vanadium, chromium, carbides thereof, copper, and mixtures thereof.

4. The diamond tool of claim 1 , wherein said diamond interface surface is smooth.

5. The diamond tool of claim 1 , wherein said diamond interface surface is rough.

6. The diamond tool of claim 1 , wherein said diamond interface surface has a concave configuration.

7. The diamond tool of claim 1 , wherein said diamond interface surface has a convex configuration.

8. The diamond tool of claim 1 , wherein said diamond interface surface configuration inversely corresponds to the shape of a drawing die.

9. The diamond tool of claim 8 , wherein said drawing die has a channel with a non-spherical shape.

10. The diamond tool of claim 1 , wherein said diamond interface surface configuration inversely corresponds to the shape of a chemical mechanical polishing (CMP) pad dresser.

11. The diamond tool of claim 1 , wherein said diamond interface surface configuration inversely corresponds to the shape of a pipe.

12. The diamond tool of claim 1 , wherein said diamond interface surface configuration inversely corresponds to the shape of a diaphragm.

13. The diamond tool of claim 1 , wherein said diamond interface surface configuration inversely corresponds to the shape of a cutting element.

14. The diamond tool of claim 13 , wherein said cutting element contains chip breakers.

15. The diamond tool of claim 1 , wherein said diamond layer has a thickness of from about 20 microns to about 200 microns.

16. The diamond tool of claim 1 , further comprising the step of increasing the thickness of said diamond layer to a desired thickness, using a non-chemical vapor deposition process.

17. The diamond tool of claim 1 , wherein said CVD technique is a member selected from the group consisting of: hot filament, microwave plasma, oxyacetylene flame, and arc jet techniques.

18. The diamond tool of claim 17 , wherein said CVD technique utilizes a combination of methane and hydrogen gasses.

19. The diamond tool of claim 1 , wherein step c) is accomplished by chemically removing the mold from the diamond layer.

Assignments (1)
AGREEMENTS AFFECTING INTEREST Recorded Aug 28, 2014
From: SUNG, CHIEN-MIN, DR.
To: KINIK COMPANY
Reel/Frame 033647/0005 →