IP Library Granted Patent US 7,049,004
Granted Patent B2
US 7,049,004 · App. 10/666,974 · Granted May 23, 2006

Index tunable thin film interference coatings

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Quick Facts
Patent No.
US 7,049,004
App. No.
10/666,974
Granted
May 23, 2006
Kind
B2
Abstract

According to various embodiments and aspects of the present invention, there is provided a dynamically tunable thin film interference coating including one or more layers with thermo-optically tunable refractive index. Tunable layers within thin film interference coatings enable a new family of thin film active devices for the filtering, control, modulation of light. Active thin film structures can be used directly or integrated into a variety of photonic subsystems to make tunable lasers, tunable add-drop filters for fiber optic telecommunications, tunable polarizers, tunable dispersion compensation filters, and many other devices.

Claims (16)

1. A multi-cavity thin-film interference filter comprising a sequence of alternating layers of amorphous silicon and a dielectric material deposited one on top of the other to form a tunable bandpass filter, said dielectric material being selected from the group consisting of silicon dioxide and silicon nitride, said sequence of alternating layers forming coupled Fabry-Perot cavity structures including at least a first Fabry-Perot cavity structure and a second Fabry-Perot cavity structure, each of said first and second Fabry-Perot cavity structures comprising:

a first multi-layer thin film interference structure forming a first mirror;

a thin-film spacer layer deposited on a top surface of the first multi-layer thin-film interference structure, said thin-film spacer layer made of said amorphous silicon; and

a second multi-layer thin film interference structure deposited on a top surface of the thin-film spacer layer and forming a second mirror;

wherein said multi-cavity filter further comprises:

a layer of electrically conductive material to which, during use, power is supplied by an external source to change the temperature of the multi-cavity thin film interference filter and thereby shift the passband of the multi-cavity thin film interference filter; and

a substrate on which the first multi-layer thin film interference structure of the first Fabry-Perot cavity structure is deposited, wherein said layer of electrically conductive material forms a ring heater on the substrate and circumscribing an optical path through the first and second Fabry-Perot cavity structures.

2. The multi-cavity thin film interference filter of claim 1 , wherein the dielectric material is silicon nitride.

3. A multi-cavity thin-film interference filter comprising a sequence of alternating layers of amorphous silicon and a dielectric material deposited one on top of the other to form a tunable bandpass filter, said dielectric material being selected from the group consisting of silicon dioxide and silicon nitride, said sequence of alternating layers forming coupled Fabry-Perot cavity structures including at least a first Fabry-Perot cavity structure and a second Fabry-Perot cavity structure, each of said first and second Fabry-Perot cavity structures comprising:

a first multi-layer thin film interference structure forming a first mirror;

a thin-film spacer layer deposited on a ton surface of the first multi-layer thin-film interference structure, said thin-film spacer layer made of said amophous silicon; and

a second multi-layer thin film interference structure deposited on a top surface of the thin-film spacer layer and forming a second mirror;

wherein said multi-cavity filter further comprises:

a layer of electrically conductive material to which, during useaower is supplied by an external source to change the temperature of the multi-cavity thin film interference filter and thereby shift the passband of the multi-cavity thin film interference filter; and

a crystalline semiconductor substrate on which the first multi-layer thin film interference structure of the first Fabry-Perot cavity structure is deposited, wherein said layer of electrically conductive material is a doped upper region of said substrate.

4. The multi-cavity thin film interference filter of claim 3 , wherein the dielectric material is silicon nitride.

Assignments (6)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2022
From: II-VI PHOTONICS, (US) INC.
To: II-VI DELAWARE, INC.
Reel/Frame 060333/0742 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
CHANGE OF NAME Recorded May 6, 2014
From: PHOTOP AEGIS, INC.
To: II-VI PHOTONICS, (US) INC.
Reel/Frame 032835/0420 →
CHANGE OF NAME Recorded May 17, 2013
From: AEGIS LIGHTWAVE, INC.
To: PHOTOP AEGIS, INC.
Reel/Frame 030452/0216 →