Thermal interface wafer and method of making and using the same
View Patent ↗A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.
1. A method for facilitating the transfer of heat from an electronic component to a heat sink across an interface therebetween, the method comprising the steps:
a) providing a thermal interface wafer interposable between said electronic component and said heat sink, said water comprising at least one elongate vertically-oriented strip substrate having first and second surfaces, said substrate having at least one layer of a phase-change, heat-conductive material formed upon a respective surface thereof, said heat-conductive material being formulated to enhance the heat transfer from said electronic component to said heat sink;
b) interposing the thermal interface wafer of step a) between said electronic component and said heat sink such that the substrate of such wafer assumes a substantially perpendicular orientation relative said electronic component and said heat sink;
c) compressively engaging said electronic component to said heat sink with said thermal interface disposed therebetween; and
d) operating said electronic component such that heat is generated thereby, said heat being sufficient to cause said phase-change, heat-conductive material in step a) to transition from a solid phase to a liquid phase.
2. The method for facilitating the transfer of heat of claim 1 wherein in step (a), said substrate comprises a thermally conductive metal foil.
3. The method of claim 2 wherein said foil is formed from the group consisting of copper, gold, silver and aluminum.
4. The method of claim 1 wherein said layer of conformable, heat-conducting material is formulated to have a melting point of approximately 51° C.
5. The method of claim 1 wherein in step a), said thermal interface wafer has a generally rectangular configuration.
6. The method of claim 1 wherein in step a), said thermal interface wafer has a generally square configuration.