IP Library Granted Patent US 6,974,976
Granted Patent B2
US 6,974,976 · App. 10/671,238 · Granted Dec 13, 2005

Thin-film solar cells

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Quick Facts
Patent No.
US 6,974,976
App. No.
10/671,238
Granted
Dec 13, 2005
Kind
B2
Abstract

A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(In X Ga 1−X )Se 2 ) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described. The machine is adapted to incorporate dual cylindrical rotary magnetron technology to manufacture the improved solar cell material in a single pass.

Claims (35)

1. A solar cell, comprising:

a substrate;

a conductive film disposed on a surface of the substrate, wherein the conductive film includes a plurality of discrete layers of conductive materials, wherein the discrete layers of conductive materials include:

at least one metallic layer of material selected from one or more groups comprising copper, silver, aluminum, molybdenum, and niobium; and

at least one barrier layer made substantially of a transition metal nitride material;

at least one p-type semiconductor absorber layer disposed on the conductive film, wherein the p-type semiconductor absorber layer includes a copper indium diselenide (CIS) based alloy material;

an n-type semiconductor layer disposed on the p-type semiconductor absorber layer, wherein the p-type semiconductor absorber layer and the n-type semiconductor layer form a p-n junction; and

a transparent electrically conductive top contact layer on the n-type semiconductor layer.

2. The solar cell of claim 1 , wherein the transition metal nitride material is selected from one or more groups comprising titanium nitride, zirconium nitride, and hafnium nitride.

3. The solar cell of claim 1 , wherein the barrier layer comprises substantially of zirconium nitride.

4. The solar cell of claim 1 , wherein the discrete layers of conductive materials include:

a plurality of metallic layers of material each selected from one or more groups comprising copper, silver, aluminum, molybdenum, and niobium; and

a plurality of barrier layers each of a transition metal nitride material.

5. The solar cell of claim 4 , wherein the barrier layers are each selected from one or more groups comprising titanium nitride, zirconium nitride, and hafnium nitride.

6. The solar cell of claim 4 , wherein the barrier layers each comprises zirconium nitride.

7. The solar cell of claim 1 , wherein the substrate comprises thin metallic foil.

8. The solar cell of claim 7 , wherein the thin metallic foil is selected from one or more groups comprising stainless steel, copper, and aluminum.

9. The solar cell of claim 1 , wherein the p-type semiconductor absorber layer has a graded bandgap.

10. A solar cell, comprising:

a substrate;

a conductive film disposed on a surface of the substrate, wherein the conductive film includes a plurality of discrete layers of conductive materials, wherein the discrete layers of conductive materials include:

a first layer of copper;

a second layer of silver; and

a plurality of barrier layers each a transition metal nitride material;

at least one p-type semiconductor absorber layer disposed on the conductive film, wherein the p-type semiconductor absorber layer includes a copper indium diselenide (CIS) based alloy material;

an n-type semiconductor layer disposed on the p-type semiconductor absorber layer, wherein the p-type semiconductor absorber layer and the n-type semiconductor layer form a p-n junction; and

a transparent electrically conductive top contact layer on the n-type semiconductor layer.

11. A solar cell comprising:

a substrate;

a conductive film disposed on a surface of the substrate, wherein the conductive film includes a plurality of discrete layers of conductive materials;

at least one p-type semiconductor absorber layer disposed on the conductive film, wherein the p-type semiconductor absorber layer includes a copper indium diselenide (CIS) based alloy material;

an n-type semiconductor layer disposed on the p-type semiconductor absorber layer, wherein the p-type semiconductor absorber layer and the n-type semiconductor layer form a p-n junction;

a transparent electrically conductive top contact layer on the n-type semiconductor layer, and

a layer of metallic material disposed between the p-type semiconductor absorber layer and the n-type semiconductor layer.

12. The solar cell of claim 11 , wherein the layer of metallic material comprises zinc.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2016
From: APOLLO PRECISION FUJIAN LIMITED
To: BEIJING APOLLO DING RONG SOLAR TECHNOLOGY CO., LTD.
Reel/Frame 037855/0478 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2015
From: HANERGY HOLDING GROUP LTD.
To: APOLLO PRECISION FUJIAN LIMITED
Reel/Frame 034826/0132 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2014
From: MIASOLE
To: HANERGY HOLDING GROUP LTD.
Reel/Frame 032092/0694 →
RELEASE OF SECURITY INTEREST Recorded Jan 7, 2013
From: PINNACLE VENTURES, L.L.C.
To: MIASOLE
Reel/Frame 029579/0494 →
SECURITY AGREEMENT Recorded Aug 28, 2012
From: MIASOLE
To: PINNACLE VENTURES, L.L.C.
Reel/Frame 028863/0887 →
CHANGE OF NAME Recorded Oct 8, 2004
From: RAYCOM TECHNOLOGIES, INC.
To: MIASOLE
Reel/Frame 015241/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2003
From: HOLLARS, DENNIS R.
To: RAYCOM TECHNOLOGIES, INC.
Reel/Frame 014551/0290 →