IP Library › Granted Patent US 7,101,275
Granted Patent B2
US 7,101,275 · App. 10/673,002 · Granted Sep 5, 2006

Resilient polishing pad for chemical mechanical polishing

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Quick Facts
Patent No.
US 7,101,275
App. No.
10/673,002
Granted
Sep 5, 2006
Kind
B2
Abstract

A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.

Claims (15)

1. A laminated polishing pad for chemical mechanical polishing, the polishing pad comprising:

a base layer;

a polishing layer overlying the base layer; and

a hot-melt adhesive layer, interposed between the base layer and the polishing layer, the adhesive layer bonding the base layer to the polishing layer, wherein a Tpeel strength of the bonding is at least greater than 40 Newtons at 305 mm/min.

2. The polishing pad of claim 1 , wherein the Tpeel strength of said bonding is at least greater than 68 Newtons at 305 mm/min.

3. The polishing pad of claim 1 , wherein the base layer is selected from the group consisting of: polymer impregnated felts or filled polymer sheets.

4. The polishing pad of claim 1 , wherein the polishing layer is selected from the group consisting of: polymer impregnated felts, poromerics, filled polymer sheets, and unfilled textured polymers.

5. The polishing pad of claim 1 , wherein the hot-melt adhesive is selected from the group consisting of: polyolefins, ethylene vinyl acetate, polyamides, polyesters, polyurethanes, polyvinyl chloride and epoxies.

6. The polishing pad of claim 1 , wherein the hot-melt adhesive layer has a thickness in the range of 2.54×10 −4 cm to 6.35×10 −2 cm.

7. A method of forming a laminated polishing pad for chemical mechanical polishing, the method comprising:

providing a base layer;

providing a polishing layer;

depositing a hot-melt adhesive on the base layer or the polishing layer;

interposing the base layer to the polishing layer with the hot-melt adhesive before the hot-melt adhesive sets; and

setting the hot-melt adhesive to bond the base layer to the polishing layer, wherein a Tpeel strength of the bond is at least greater than 40 Newtons at 305 mm/min.