IP Library Granted Patent US 6,858,796
Granted Patent B1
US 6,858,796 · App. 10/673,695 · Granted Feb 22, 2005

Grounding mechanism retention feature

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Quick Facts
Patent No.
US 6,858,796
App. No.
10/673,695
Granted
Feb 22, 2005
Kind
B1
Abstract

An electromagnetic (EM) shielding assembly includes an electrically conductive shielding portion and one or more electrically conductive protrusions for engaging with respective conductive apertures in a circuit board. The electrically conductive protrusions can be in electrical communication with the EM shielding portion. The protrusions can enable the EM shielding assembly to be attached to a circuit board in a computer system while also providing an electrical connection to logical ground. Further components, for example a heat sink that may be in electrical communication with the EM shielding portion, may thereby also be connected to logical ground.

Claims (20)

1. An electromagnetic (EM) shielding assembly for a computer system, the assembly comprising:

an electrically conductive shielding portion configured to provide EM shielding for a component of the computer system; and

at least one electrically conductive protrusion in electrical communication with the shielding portion and comprising a serrated edge for engaging with an inner surface of a conductive aperture in a circuit board to secure the shielding assembly to the circuit board.

2. The EM shielding assembly of claim 1 , wherein the protrusion is formed integrally with the electrically conductive shielding portion.

3. The EM shielding assembly of claim 1 , wherein the electrically conductive protrusion comprises a tapered end.

4. The EM shielding assembly of claim 1 , wherein the electrically conductive protrusion comprises a flat edge configured to abut an electrically conductive surface defining said aperture.

5. The EM shielding assembly of claim 1 , wherein said protrusion comprises a latching portion configured to latch onto the underside of the circuit board.

6. The EM shielding assembly of claim 1 , wherein said serrated edge comprises one or more barbs or serrations configured to engage with the inner surface.

7. The EM shielding assembly of claim 1 , wherein the serrated edge is biased to facilitate insertion of the electrically conductive protrusion into said conductive aperture.

8. The EM shielding assembly of claim 1 , wherein the electrically conductive protrusion is substantially cylindrical.

9. The EM shielding assembly of claim 1 , wherein the protrusion is configured to slant away from the shielding portion.

10. A computer system comprising a circuit board with a conductive aperture, an electrical component mounted on the circuit board, and an EM shielding assembly comprising:

an electrically conductive shielding portion configured to provide EM shielding for the electrical component; and

an electrically conductive protrusion in electrical communication with the shielding portion and comprising a serrated edge engaged with an inner surface of the conductive aperture for securing the shielding assembly to the circuit board.

11. A method of providing electromagnetic (EM) shielding for a component of a computer system, the method comprising:

providing an EM shielding assembly comprising an electrically conductive shielding portion and an electrically conductive protrusion in electrical communication with the shielding portion, the protrusion comprising a serrated edge for engaging with an inner surface of a conductive aperture in a circuit board of the computer system; and

securing the shielding assembly to the circuit board, wherein the securing comprises engaging the serrated edge with the conductive aperture.

12. An electromagnetic (EM) shielding assembly for a computer system, the assembly comprising:

electrically conductive shielding means for providing EM shielding for a component of the computer system; and

electrically conductive protrusion means in electrical communication with the shielding means and comprising serrated edge means for engaging with an inner surface of a conductive aperture in a circuit board to secure the shielding assembly to the circuit board.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 12, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037278/0790 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2004
From: GARNETT, PAUL JEFFREY; OSBORN, JAY KEVIN; BESTWICK, GRAHAM; SUN MICROSYSTEMS LIMITED
To: SUN MICROSYSTEMS, INC.
Reel/Frame 015023/0367 →