Kinetic sprayed electrical contacts on conductive substrates
View Patent ↗The present invention is directed to electrical contacts that comprise spaced electrically conductive particles embedded and bonded into the surface of conductors in which the particles have been kinetically sprayed onto the conductors with sufficient energy to form direct mechanical bonds between the particles and the conductors in a pre-selected location and particle number density that promotes high surface-to-surface contact and reduced contact resistance between the conductors.
1. An electrical connector comprising:
a first surface formed from a first electrically conductive material and embedded on said surface a plurality of spaced apart particles of a second electrically conductive material, said particles having a nominal pre-embedded diameter of greater than 50 microns and forming a discontinuous layer raised on said surface with said second electrically conductive material being other than said first electrically conductive material and with said electrical connector having a contact resistance of less than 10 milli-Ohms.
2. The electrical connector of claim 1 wherein said first surface is made from a metal comprising at least one of copper, aluminum, brass, stainless steel or tungsten.
3. The electrical connector of claim 1 wherein said particles comprise at least one of tin, silver, gold, platinum, metal alloys, or mixtures thereof.
4. The electrical connector of claim 3 wherein said particles comprise tin or mixtures of tin and any other metal.
5. The electrical connector of claim 4 wherein said particles comprise alloys of at least one of tin-copper, tin-silver, or tin-lead.
6. The electrical connector of claim 1 wherein said particles have a nominal pre-embedded diameter of greater than 75 microns.
7. The electrical connector of claim 1 wherein said electrical connector has a contact resistance of less than 2 milli-Ohms.
8. The electrical connector of claim 1 wherein said embedded particles have an aspect ratio of 5 to 1.
9. The electrical connector of claim 1 wherein said embedded particles have an average height of equal to or less than 25 microns above the first surface.
10. An electrical connection comprising: a first connector having a first surface formed from a first electrically conductive material and embedded on said surface a plurality of spaced apart particles of a second electrically conductive material, said particles having a nominal pre-embedded diameter of greater than 50 microns and forming a discontinuous layer raised on said surface with said second electrically conductive material being other than said first electrically conductive material; and a second connector releasably engaged with the first connector, thereby forming said electrical connection.
11. The electrical connection of claim 10 wherein said first surface is made from a metal comprising at least one of copper, aluminum, brass, stainless steel or tungsten.
12. The electrical connection of claim 10 wherein said particles comprise at least one of tin, silver, gold, platinum, metal alloys, or mixtures thereof.
13. The electrical connection of claim 12 wherein said particles comprise tin or mixtures of tin and any other metal.
14. The electrical connection of claim 13 wherein said particles comprise alloys of at least one of tin-copper, tin-silver, or tin-lead.
15. The electrical connection of claim 10 wherein said particles have a nominal pre-embedded diameter of greater than 75 microns.
16. The electrical connection of claim 10 wherein said electrical connector has a contact resistance of less than 10 milli-Ohms.
17. The electrical connection of claim 10 wherein said electrical connector has a contact resistance of less than 2 milli-Ohms.
18. The electrical connection of claim 10 wherein said embedded particles have an aspect ratio of 5 to 1.
19. The electrical connector of claim 10 wherein said embedded particles have an average height of equal to or less than 25 microns above the first surface.