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App. No. 10/677,078 · Confirmation No. 8341

Integrated circuit package employing flip-chip technology and method of assembly

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2005-05-16 ABN Abandonment 2 View
2004-08-11 CTFR Final Rejection 13 View
2004-08-11 892 List of references cited by examiner 1 View
2004-08-11 FWCLM Index of Claims 1 View
2004-07-01 WFEE Fee Worksheet (SB06) 2 View
2004-07-01 FWCLM Index of Claims 1 View
2004-06-21 A... Amendment/Request for Reconsideration-After Non-Final Rejection 4 View
2004-06-21 CLM Claims 7 View
2004-06-21 REM Applicant Arguments/Remarks Made in an Amendment 3 View
2004-04-23 CTNF Non-Final Rejection 8 View
2004-04-23 1449 List of References cited by applicant and considered by examiner 2 View
2004-04-23 892 List of references cited by examiner 1 View
2004-04-23 FWCLM Index of Claims 1 View
2004-04-23 SRFW Search information including classification, databases and other search related notes 1 View
2004-04-07 SRNT Examiner's search strategy and results 4 View
2003-09-30 TRNA Transmittal of New Application 2 View
2003-09-30 SPEC Specification 15 View
2003-09-30 CLM Claims 7 View
2003-09-30 ABST Abstract 1 View
2003-09-30 DRW Drawings-only black and white line drawings 25 View
2003-09-30 OATH Oath or Declaration filed 2 View
2003-09-30 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2003-09-30 WFEE Fee Worksheet (SB06) 1 View
2003-09-30 WFEE Fee Worksheet (SB06) 1 View
2003-09-30 CLMPTO Complete Marked Up Copy of Claims Prepared by USPTO 5 View
2003-09-30 WFEE Fee Worksheet (SB06) 1 View
2003-09-30 FWCLM Index of Claims 1 View
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Quick Facts
App. No.
10/677,078
Filed
2003-09-30
Pub. No.
US20040036152A1
Examiner
CAO, PHAT X
Art Unit
2814