Composition for eliminating thermosetting resin
View Patent ↗An apparatus containing a composition suitable for eliminating a thermosetting resin is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.
1. A thermosetting resin eliminating apparatus, comprising:
a stripping unit to strip a substrate having a layer from a thermosetting resin, said stripping unit including a vessel or tub into which the substrate is dipped, the vessel or tub containing a composition consisting of tetra methyl ammonium hydroxide (TMAH), water, and a hygroscopic resin solvent; and
a separate cleaning unit to mechanically clean the stripped substrate using water, wherein the hydroscopic resin solvent is about 50% wt of the composition and the TMAH and water are about 50% wt of the composition.
2. The apparatus of claim 1 , wherein said hygroscopic resin solvent is diethylene glycol ethyl ether.
3. The apparatus of claim 2 , wherein:
said TMAH is in a range of about 7-10 wt %; and said diethylene glycol ethyl ether is about 50 wt %.
4. The apparatus of claim 3 , wherein said water is in a range of about 40-43 wt %, respectively, relative to said TMAH.
5. The apparatus of claim 4 , wherein said TMAH is in a range of about 7-8 wt % and said water is in a range of about 42-43 wt %, respectively, relative to said TMAH.
6. The apparatus of claim 4 , wherein said TMAH is about 10 wt % and said water is about 40 wt % relative to said TMAH.
7. The apparatus of claim 1 , wherein said water is de-ionized water.
8. A thermosetting resin eliminating apparatus, comprising:
a stripping unit to strip a substrate having a layer from a thermosetting resin, said stripping unit including a vessel or tub into which the substrate is dipped, the vessel or tub containing a composition consisting of tetra methyl ammonium hydroxide (TMAH), water, and a hygroscopic resin solvent; and
a separate brushing cleaning unit to mechanically clean the stripped substrate using water, wherein the hydroscopic resin solvent is about 50% wt of the composition and the TMAH and water are about 50% wt of the composition.
9. The apparatus of claim 8 , wherein said hygroscopic resin solvent is diethylene glycol ethyl ether.
10. The apparatus of claim 9 , wherein:
said TMAH is in a range of about 7-10 wt %; and
said diethylene glycol ethyl ether is about 50 wt %.
11. The apparatus of claim 10 , wherein said water is in a range of about 40-43 wt %, respectively, relative to said TMAH.
12. The apparatus of claim 11 , wherein said TMAH is in a range of about 7-8 wt % and said water is in a range of about 42-43 wt %, respectively, relative to said TMAH.
13. The apparatus of claim 11 , wherein said TMAH is about 10 wt % and said water is about 40 wt % relative to said TMAH.
14. The apparatus of claim 8 , wherein said water is de-ionized water.
15. A thermosetting resin eliminating apparatus, comprising:
a stripping unit to strip a substrate having a layer from a thermosetting resin, said stripping unit including a vessel or tub into which the substrate is dipped, the vessel or tub containing a composition consisting of tetra methyl ammonium hydroxide (TMAH), water, and a hygroscopic resin solvent; and
a separate supersonic cleaning unit to mechanically clean the stripped substrate using water, wherein the hydroscopic resin solvent is about 50% wt of the composition and the TMAH and water are about 50% wt of the composition.
16. The apparatus of claim 15 , wherein said hygroscopic resin solvent is diethylene glycol ethyl ether.
17. The apparatus of claim 16 , wherein:
said TMAH is in a ran of about 7-10 wt %; and
said diethylene glycol ethyl ether is about 50 wt %.
18. The apparatus of claim 17 , wherein said water is in a range of about 40-43 wt %, respectively, relative to said TMAH.
19. The apparatus of claim 18 , wherein said TMAH is in a range of about 7-8 wt % and said water is in a range of about 42-43 wt %, respectively, relative to said TMAH.
20. The apparatus of claim 18 , wherein said TMAH is about 10 wt % and said water is about 40 wt % relative to said TMAH.
21. The apparatus of claim 15 , wherein said water is de-ionized water.