IP Library Granted Patent US 6,925,876
Granted Patent B2
US 6,925,876 · App. 10/679,794 · Granted Aug 9, 2005

Multiple output inertial sensing device

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Quick Facts
Patent No.
US 6,925,876
App. No.
10/679,794
Granted
Aug 9, 2005
Kind
B2
Abstract

An inertial sensor includes a single sense element disposed upon a silicon wafer. The sense element is electrically connected to a plurality of signal conditioning circuits that generate output signals in different ranges. Each signal conditioning circuit has an output that is electrically connected to an associated control device.

Claims (12)

1. An inertial sensor adapted to be attached to a body comprising:

a base member, said base member being formed from a silicon wafer;

a single angular rate sensor disposed on said base member, said angular rate sensor operable to sense a change in an angular velocity of said body; and

a plurality of signal conditioning circuits connected to said angular rate sensor, with a first one of said signal conditioning circuits being calibrated to sense a first range of angular velocity change and a second one of said signal conditioning circuits being calibrated to sense a second range of angular velocity change, said second range of angular velocity change being different from said first range of angular velocity change, said signal conditioning circuits adapted to be connected to at least one control system, said signal conditioning circuits operable to generate an electrical signal that is a function of said change in said angular velocity of said body.

2. The inertial sensor according to claim 1 wherein said signal conditioning circuits are integral with said silicon wafer and said angular rate sensor.

3. The inertial sensor according to claim 2 including a device for combining signals connected to said signal conditioning circuits, said device operable to combine the signals generated by said plurality of signal conditioning circuits into a single output signal.

4. The inertial sensor according to claim 2 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

5. The inertial sensor according to claim 1 wherein said signal conditioning circuits are located remotely from said silicon wafer and said angular rate sensor.

6. The inertial sensor according to claim 5 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

7. The inertial sensor according to claim 5 including a device for combining signals connected to said signal conditioning circuits, said device operable to combine the signals generated by said plurality of signal conditioning circuits into a single output signal.

8. The inertial sensor according to claim 1 wherein said signal conditioning circuits are included within an Application Specific Integrated Circuit.

9. The inertial sensor according to claim 1 including a device for combining signals connected to said signal conditioning circuits, said device operable to combine the signals generated by said plurality of signal conditioning circuits into a single output signal.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Nov 15, 2013
From: JPMORGAN CHASE BANK, N.A.
To: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY; TRW INTELLECTUAL PROPERTY CORP.
Reel/Frame 031645/0697 →
SECURITY AGREEMENT Recorded Dec 21, 2012
From: TRW VEHICLE SAFETY SYSTEMS INC.; TRW AUTOMOTIVE U.S. LLC; KELSEY-HAYES COMPANY
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 029529/0534 →
SECURITY INTEREST Recorded Mar 31, 2005
From: KELSEY-HAYES COMPANY; TRW AUTOMOTIVE U.S. LLC; TRW VEHICLE SAFETY SYSTEMS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 015991/0001 →