Flip chip heat sink package and method
View Patent ↗An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.
1. An electronic package comprising:
a substrate having electrical conductors thereon;
a flip chip mounted to the substrate, the flip chip having a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface, the flip chip being mounted to the substrate such that the solder bumps are registered with the conductors on the substrate;
a heat sink in heat transfer relationship with the second surface of the flip chip, wherein the heat sink includes a cavity formed in a region adjacent to the flip chip; and
a case in heat transfer relationship with the substrate, with the heat sink comprising a cover.
2. The package as defined in claim 1 further comprising a thermally conductive material disposed within the cavity of the heat sink.
3. The package as defined in claim 2 , wherein the thermally conductive material comprises a metal insert.
4. The package as defined in claim 2 , wherein the thermally conductive material comprises solder.
5. The package as defined in claim 2 , wherein the thermally conductive material comprises a phase change material.
6. The package as defined in claim 1 , wherein the heat sink provides a first heat conduction path and the case provides a second heat conduction path for dissipating heat energy away from the flip chip.
7. The package as defined in claim 6 further comprising a plurality of conductive vias formed within the substrate for conducting heat from the first surface of the flip chip through the substrate to the thermally conductive member.
8. The package as defined in claim 1 , wherein the heat sink comprises a stamped metal heat sink.
9. The package as defined in claim 1 further comprising a plurality of cooling fins.
10. The package as defined in claim 1 further comprising a thermally conductive interface material disposed between the second surface of the flip chip and the heat sink.