Process for making an organic electronic device having a roughened surface heat sink
View Patent ↗An aspect of the present invention provides an organic electronic device includes a heat sink having a side with a roughened surface and/or a black surface and a process for forming devices having such heat sinks including forming a patterned electrically conductive layer includes an electrically conductive member. The process includes selectively forming spaced-apart members. The heat sink includes the spaced-apart members, which are spaced apart from each other and thermally coupled to the electrically conductive member.
1. A process for forming an organic electronic device comprising:
forming an organic layer over a substrate, wherein the organic layer comprises an organic active layer;
forming a patterned electrically conductive layer over the organic layer, wherein the patterned electrically conductive layer comprises an electrically conductive member for the organic electronic device; and
selectively forming spaced-apart members over the patterned electrically conductive layer, wherein:
a heat sink comprises the spaced-apart members;
the spaced-apart members are spaced apart from each other; and
the spaced-apart members are thermally coupled to the electrically conductive member.
2. The process of claim 1 , further comprising placing a first stencil mask over the patterned electrically conductive layer before selectively forming the spaced-apart members, wherein the first stencil mask has openings corresponding to shapes of the spaced-apart members.
3. The process of claim 2 , further comprising placing a second stencil mask over the substrate before forming the patterned electrically conductive layer, wherein:
the second stencil mask has an opening corresponding to a shape of the electrically conductive member; and
selectively toning is performed by a method selected from the group consisting of vapor depositing, coating, casting, and printing.
4. The process of claim 1 , wherein:
selectively forming the spaced-apart members comprises plating; and
the spaced-apart members comprise an electrically conductive material.
5. The process of claim 4 , further comprising forming a patterned insulating layer before selectively forming, wherein the patterned insulating layer has openings corresponding to locations where second members will be formed during selectively forming.
6. The process of claim 1 , wherein the electrically conductive member is an electrode for the organic electronic device.
7. A process for forming an organic electronic device comprising:
forming an organic layer over a substrate, wherein the organic layer comprises an organic active layer;
forming a first layer over the organic layer;
forming a patterned resist layer over the first layer, wherein an exposed portion of the first layer underlies an opening within the patterned resist layer; and
etching at least partially through the exposed portion of the first layer, wherein a heat sink comprises of the first layer.
8. The process of claim 7 , wherein etching comprises wet etching.
9. The process of claim 7 , wherein etching comprises dry etching.