IP Library Granted Patent US 7,109,520
Granted Patent B2
US 7,109,520 · App. 10/683,829 · Granted Sep 19, 2006

Heat sinks

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Quick Facts
Patent No.
US 7,109,520
App. No.
10/683,829
Granted
Sep 19, 2006
Kind
B2
Abstract

An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm 2 and mm, respectively.

Claims (19)

1. An organic electronic device comprising a heat sink, wherein:

the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;

the heat sink has a thickness no greater than 9 mm; and

the heat sink is attached to an array within the organic electronic device.

2. The organic electronic device of claim 1 , wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

3. The organic electronic device of claim 2 , wherein the heat sink has a thickness no greater than 500 microns.

4. The organic electronic device of claim 2 , wherein the heat sink lies within 90 μm of an organic active layer of the organic electronic device.

5. Organic electronic device of claim 2 , wherein the side with the pattern has a black surface.

6. The organic electronic device for claim 2 , wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

7. The organic electronic device of claim 1 , wherein the side with the pattern is black.

8. An organic electronic device comprising a heat sink, wherein: the heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink;

the heat sink has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm2 and mm, respectively; and

the heat sink is attached to an array within the organic electronic device.

9. The organic electronic device of claim 8 , wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

10. The organic electronic device of claim 9 , wherein the heat sink has a thickness no greater than 500 microns.

11. The organic electronic device of claim 9 , wherein the ratio of area:thickness is at least 11,000:1.

12. The organic electronic device of claim 9 , wherein the heat sink lies within 90 μm of an organic active layer of the organic electronic device.

13. The organic electronic device of claim 12 , wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

14. The organic electronic device of claim 9 , wherein the side with the pattern has a black surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: LG CHEM, LTD.
Reel/Frame 050150/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2004
From: DUPONT DISPLAYS, INC.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 014666/0358 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 19, 2004
From: YU, GANG; WANG, JIAN
To: DUPONT DISPLAYS, INC.
Reel/Frame 014352/0256 →