Excimer laser crystallization of amorphous silicon film
View Patent ↗A method of crystallizing an amorphous silicon layer includes the steps of generating an excimer laser beam having a first energy density and a second energy density, irradiating an amorphous silicon layer with at least one exposure of the excimer, wherein the first energy density melts the amorphous silicon layer to a first depth from a surface of the amorphous silicon layer equal to the first thickness and the second energy density melts the amorphous silicon layer to a second depth from the surface of the amorphous silicon layer less than the first thickness.
1. An excimer laser system for crystallizing an amorphous silicon layer, comprising;
an excimer laser generator that generates an excimer laser beam having a Gaussian energy density profile;
a beam homogenizer to transform the excimer laser beam into a laser beam having a stepped energy density distribution profile that includes at least a first energy density and a second energy density, wherein the first energy density is at least 380 mJ/cm 2 and the second energy density ranges from 310 mJ/cm 2 to 370 mJ/cm 2 ; and
a filter disposed between the excimer laser generator and the beam homogenizer.
2. The system according to claim 1 , wherein the filter includes at least two beam stops.
3. The system according to claim 2 , wherein the beam stops include at least a material selected from a group comprising nickel (Ni) and molybdenum (Mo).
4. The system according to claim 1 , wherein the first energy density melts the amorphous silicon layer to a first depth from a surface of the amorphous silicon layer that is equal to a first thickness of the amorphous silicon layer and the second energy density melts the amorphous silicon layer to a second depth from the surface of the amorphous silicon layer that is less than the first depth.
5. The system according to claim 1 , wherein an energy density difference between the first and second energy densities is about 10 to 15 mJ/cm 2 .