IP Library Granted Patent US 7,103,408
Granted Patent B2
US 7,103,408 · App. 10/691,201 · Granted Sep 5, 2006

Electrode assembly for a microstimulator

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Quick Facts
Patent No.
US 7,103,408
App. No.
10/691,201
Granted
Sep 5, 2006
Kind
B2
Abstract

An electrode assembly includes an electrode electrically connected to a capacitor with a wire. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.

Claims (25)

1. A method of electrically attaching a wire to a capacitor and an electrode of a microstimulator, comprising:

providing an electrode;

forming a hole trough the electrode;

providing a wire;

preparing the wire to prevent the wire from slipping through the hole in the electrode;

threading the wire through the hole in the electrode;

providing a capacitor;

creating an electrical connection between the wire and the capacitor; and

electrically connecting the wire to the electrode.

2. The method of claim 1 , further comprising:

bending an end of the wire before creating an electrical connection between the wire and the capacitor;

creating an electrical connection between the bent end of the wire and the capacitor;

removing excess wire from the bent end of the wire after creating an electrical connection between the wire and the capacitor;

removing excess wire from the wire where the wire electrically connects to the electrode after electrically connecting the wire to the electrode.

3. The method of claim 2 , wherein electrically connecting the wire to the electrode includes laser spot welding and wherein removing excess wire includes laser spot welding.

4. The method of claim 2 , further comprising:

securing the electrode wire, and capacitor in an assembly carrier before creating an electrical connection between the wire and the capacitor;

tightening an elevator screw on the assembly carrier to raise the capacitor until the capacitor touches the wire; and

vertically housing the electrode, wire, and capacitor in an assembly carrier before electrically connecting the wire where it exits the electrode.

5. The method of claim 1 , further comprising providing slack in the wire between the electrode and the capacitor.

6. The method of claim 1 , wherein providing an electrode includes providing an electrode that is attached to a braze assembly.

7. The method of claim 1 , wherein forming a hole through the electrode includes drilling a small diameter hole with a small diameter drill bit.

8. The method of claim 1 , wherein preparing the wire includes at least one of: bending the wire, clipping another structure to the wire, and attaching at least one other structure to the wire.

9. The method of claim 1 , wherein bending an end of the wire further includes bending the wire to a shape that permits maximum electrical contact with the capacitor.

10. The method of claim 1 , wherein the electrode is attached to a braze assembly of a microstimuletor.

Assignments (2)
CHANGE OF NAME Recorded Oct 6, 2009
From: ADVANCED BIONICS CORPORATION
To: BOSTON SCIENTIFIC NEUROMODULATION CORPORATION
Reel/Frame 023330/0168 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2006
From: HALLER, MATTHEW I.; HE, TOM XIAOHAI; DAULTON, JAY
To: ADVANCED BIONICS CORPORATION
Reel/Frame 017953/0691 →