Polycrystalline silicon thin film, fabrication method thereof, and thin film transistor without directional dependency on active channels fabricated using the same
View Patent ↗A polycrystalline silicon thin film to be used in display devices, the thin film having adjacent primary grain boundaries that are not parallel to each other, wherein an area surrounded by the primary grain boundaries is larger than 1 μm 2 , a fabrication method of the polycrystalline silicon thin film, and a thin film transistor fabricated using the method.
1. A polycrystalline silicon thin film to be used in display devices, the thin film comprising primary grain boundaries, wherein adjacent ones of the primary grain boundaries are not parallel to each other, wherein an area surrounded by the primary grain boundaries is larger than 1 μm 2 , wherein grains of polycrystalline silicon extend in a plurality of directions in the area from each of the primary grain boundaries, and wherein the area does not contain any substance added to promote crystallization of silicon in the area.
2. The polycrystalline silicon thin film according to claim 1 , wherein the primary grain boundaries are formed in a closed curve shape or a closed polygonal shape.
3. The polycrystalline silicon thin film according to claim 1 , wherein the primary grain boundaries are formed in a rectangular or a hexagonal shape.
4. The polycrystalline silicon thin film according to claim 1 , wherein the primary grain boundaries are symmetrical to each other centering around a certain axis passing through the primary grain boundaries.
5. A thin film transistor fabricated using the polycrystalline silicon thin film according to claim 1 .
6. The thin film transistor according to claim 5 , wherein the thin film transistor is used in an organic electroluminescent display device.
7. The polycrystalline silicon thin film according to claim 1 , wherein the area contains an amorphous silicon portion.
8. The polycrystalline silicon thin film according to claim 7 , wherein the grains of polycrystalline silicon extend from the amorphous silicon portion in the area to the primary grain boundaries surrounding the area.
9. The polycrystalline silicon thin film according to claim 1 , wherein each of the primary grain boundaries is a boundary where grains of polycrystalline silicon grown in different directions meet.
10. A polycrystalline silicon thin film to be used in display devices, the thin film comprising primary grain boundaries, wherein adjacent ones of the primary grain boundaries are not parallel to each other, wherein an area surrounded by the primary grain boundaries is larger than 1 μm 2 , and wherein polycrystalline silicon grains extend to the primary grain boundaries from an amorphous silicon portion in the area.
11. The polycrystalline silicon thin film according to claim 10 , wherein the primary grain boundaries are formed in a closed curve shape or a closed polygonal shape.
12. The polycrystalline silicon thin film according to claim 10 , wherein the primary grain boundaries are formed in a rectangular shape or a hexagonal shape.
13. The polycrystalline silicon thin film according to claim 10 , wherein the primary grain boundaries are symmetrical to each other centering around a certain axis passing through the primary grain boundaries.
14. A thin film transistor fabricated using the polycrystalline silicon thin film according to claim 10 .
15. The thin film transistor according to claim 14 , wherein the thin film transistor is used in an organic electroluminescent display device.
16. The polycrystalline silicon thin film according to claim 10 , wherein each of the primary grain boundaries is a boundary where polycrystalline silicon grains grown in different directions meet.