Printed circuit board with void between pins
View Patent ↗A circuit board includes at least one insulator layer and a plurality of conductors over which a plurality of signals is carried. A plurality of terminals is coupled to at least a subset of the plurality of conductors. A void is formed in the circuit board between at least two terminals.
1. An article of manufacture, comprising:
a circuit board including at least one insulator layer and a plurality of conductors over which a plurality of signals is carried;
a plurality of terminals coupled to at least a subset of the plurality of conductors; and
a void formed in the circuit board between at least two terminals;
wherein the terminals include a plurality of holes formed in the circuit board, each hole being plated with a conductive ring that is coupled to at least one of the subset of the plurality conductors;
wherein the void is formed in the circuit board between at least two conductive rings; and
further comprising a connector mounted on the circuit board, the connector having a plurality of connector pins, wherein each of the plurality of connector pins is inserted into a respective one of the plurality of holes.
2. The article of manufacture of claim 1 , wherein the connector includes a plurality of sockets.
3. The article of manufacture of claim 1 , wherein the article of manufacture is a backplane.
4. The article of manufacture of claim 1 , wherein the circuit board comprises a multi-layer printed circuit bard.
5. A backplane comprising:
a printed circuit board having at least one insulator layer and a plurality of conductors over which a plurality of signals is carried;
wherein the printed circuit board includes:
a plurality of holes formed in the printed circuit board, each of the plurality of holes having a conductive plating coupled to at least one of the plurality of conductors; and
a void formed in the printed circuit board between at least two of the plurality of holes; and
wherein the printed circuit board further includes a connector mounted on the circuit board, the connector having a plurality of connector pins, wherein each of the plurality of connector pins is inserted into a respective one of the plurality of holes.
6. The backplane of claim 5 , wherein the conductive plating of at least one of the plurality of holes between which the void is formed is coupled to a TNV-3 circuit.
7. The backplane of claim 6 , wherein the TNV-3 circuit is coupled to a twisted-pair telephone line used to provision a digital subscriber line channel.
8. The backplane of claim 7 , wherein the digital subscriber line channel is a high-speed digital subscriber line channel.
9. The backplane of claim 5 , wherein the void has an oval shape.
10. The backplane of claim 5 , further comprising a direct current power input.
11. The backplane of claim 5 , farther comprising a filter.
12. A telecommunication system comprising:
a chassis having a plurality of slots;
a backplane inserted into the chassis; and
a plurality of cards, each card inserted into one of the plurality of slots;
wherein the backplane comprises:
a backplane circuit board that includes a plurality of backplane conductors over which a plurality of backplane signals is carried; and
a plurality of card interfaces, each card interface including a plurality of holes formed in the backplane circuit board, wherein each bole has a conductive plating coupled to at least one of the plurality of backplane conductors;
wherein each of the plurality of cards comprises:
a card circuit board that includes a plurality of card conductors over which a plurality of card signals is carried; and
a backplane interface that couples that card to one of the plurality of card interfaces of the backplane, wherein the backplane interface includes a plurality of pins and wherein each pin is coupled to at least one card conductor, and
wherein at least one of the card interfaces includes a void formed in the backplane circuit board between at least two of the plurality of holes included in that card interface.
13. The telecommunication system of claim 12 , wherein the conductive plating of at least one of the plurality of holes between which the void is formed is coupled to a TNV-3 circuit.
14. The telecommunication system of claim 13 , wherein the TNV-3 circuit is coupled to a twisted-pair telephone line used to provision a digital subscriber line channel.
15. The telecommunication system of claim 14 , wherein the digital subscriber line channel is a high-speed digital subscriber line channel.