IP Library Granted Patent US 7,378,834
Granted Patent B2
US 7,378,834 · App. 10/695,344 · Granted May 27, 2008

Electronic assembly tester and method for optoelectronic device

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Quick Facts
Patent No.
US 7,378,834
App. No.
10/695,344
Granted
May 27, 2008
Kind
B2
Abstract

An electronic assembly tester for testing an electrical component of an optoelectronic device. The electrical component includes a transmit and receive port. The tester includes of a base, an arm, and a hinge. The arm includes a flex circuit and cables. The arm is rotated into a closed position to form a temporary electrical connection between the electrical component and the flex circuit. Other configurations for forming a temporary electrical connection between the test circuit and the electrical component are possible. The electrical component is evaluated by providing a data signal to the transmit portion of the electrical component and evaluating a return data signal obtained from the receive portion of the electrical component.

Claims (50)

1. An assembly for testing electrical components of optoelectronic devices before the electrical components are connected with the optical components of the optoelectronic device, the assembly comprising:

a base having a printed circuit board receptacle configured to receive a printed circuit board of an electrical component; and

an arm connected to the base, the arm comprising:

a flexible circuit having a data input and a data output; and

cable connectors connected to a first end of the flexible circuit and configured to physically and electrically interface with respective cables,

wherein the arm is selectively positionable between an open and a closed position, wherein in the closed position, a temporary electrical connection is formed between at least one of:

the data input and a transmit port of the electrical component, and

the data output and a receive port of the electrical component,

wherein a plurality of pads are positioned at a second end of the flexible circuit configured to at least partially form the temporary electrical connection.

2. The assembly as recited in claim 1 , wherein the arm is pivotally connected to the base.

3. The assembly as recited in claim 1 , the arm further comprising at least one pressure fixture for applying pressure to the data input connection and data output connection of the flexible circuit against the transmit port and receive port of the electrical component, respectively, when the arm is in the closed position.

4. The assembly as recited in claim 3 , wherein the at least one pressure fixture comprises a spring loaded pin.

5. The assembly as recited in claim 3 , wherein the at least one pressure fixture comprises a piece of foam.

6. The assembly as recited in claim 1 , the base and arm further comprising at least one magnet disposed thereon for assisting the arm in forming the temporary electrical connection between the flexible circuit and the electrical component.

7. The assembly as recited in claim 1 , further comprising:

a first cable connected to the data input; and

a second cable connected to the data output.

8. The assembly as recited in claim 7 , wherein the first and the second cables comprise coaxial cables.

9. The assembly as recited in claim 7 , wherein the first cable and the second cable are the same cable.

10. The assembly as recited in claim 1 , wherein the flexible circuit further comprises:

a data transmit port; and

a data receive port, wherein the data transmit port and the data receive port are configured to be electrically connected to a tester apparatus.

11. The assembly as recited in claim 10 , wherein when the arm is in the closed position, a temporary connection is formed between at least one of:

the transmit port of the electronic component and the data transmit port of the flexible circuit, and

the receive port of the electronic component and the data receive port of the flexible circuit.

12. The assembly as recited in claim 1 , further comprising a host computer configured to be placed in electrical connection with the printed circuit board of the electrical component.

13. The assembly as recited in claim 1 , wherein the transmit port and receive port of the electrical component are configured to be coupled to a transmitter optical assembly and a receiver optical assembly, respectively.

14. The assembly as recited in claim 1 , further comprising a mechanical clamp for applying pressure to the data input connection and data output connection of the flexible circuit against the transmit port and receive port of the electrical component, respectively, when the arm is in the closed position.

15. The assembly as recited in claim 1 , wherein the flexible circuit comprises:

a flexible dielectric substrate having a front side upon which the data input and the data output are positioned; and

a ground conductor on a back side of the dielectric substrate.

16. An assembly for testing electrical components of optoelectronic devices before the electrical components are connected with the optical components of the optoelectronic device, the assembly comprising:

a base having a printed circuit board receptacle configured to receive a printed circuit board of an electrical component; and

an arm connected to the base, the arm comprising:

a flexible circuit having a data input and a data output, the flexible circuit further comprising:

a flexible dielectric substrate having a front side upon which the data input and the data output are positioned; and

a ground connector on a back side of the dielectric substrate; and

cable connectors connected to a first end of the flexible circuit and configured to physically and electrically interface with respective cables,

wherein the arm is selectively positionable between an open and a closed position, wherein in the closed position, a temporary electrical connection is formed between at least one of:

the data input and a transmit port of the electrical component, and

the data output and a receive port of the electrical component.

17. An assembly for testing electrical components of optoelectronic devices before the electrical components are connected with the optical components of the optoelectronic device, the assembly comprising:

a base having a printed circuit board receptacle configured to receive a printed circuit board of an electrical component;

an arm connected to the base, the arm comprising:

a flexible circuit having a data input and a data output; and

cable connectors connected to a first end of the flexible circuit and configured to physically and electrically interface with respective cables,

wherein the arm is selectively positionable between an open and a closed position, wherein in the closed position, a temporary electrical connection is formed between at least one of:

the data input and a transmit port of the electrical component, and

the data output and a receive port of the electrical component; and

one or more magnets positioned on the base and the arm to assist the arm in forming the temporary electrical connection.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →