Pressure sensor module having stress isolation platform

1. A pressure sensor module comprising:

a base structure; and

a pressure sensor adhered to the base structure via an adhesive layer, said pressure sensor comprising a pressure sensing element, wherein the adhesive layer adheres only a first portion of the pressure sensor to the base structure to create an isolation gap between a second portion of the sensor and the base structure, wherein the isolation gap forms a cantilever member via the second portion of the sensor that provides stress isolation to the pressure sensing element.

2. The pressure sensor module as defined in claim 1 , wherein the sensor comprises a sensor cell further comprising electrical circuitry.

3. The pressure sensor module as defined in claim 1 , wherein the base structure comprises a substrate.

4. A pressure sensor module comprising:

a base structure comprising a first member and a second member fixed to the first member;

an adhesive layer adhering only a first portion of the first member to the second member to create an isolation gap between a second portion of the first member and the second members, wherein a cantilever member is formed via the second portion of the first member by the isolation gap; and

a pressure sensing element located on the cantilever member, wherein the cantilever member provides stress isolation to the pressure sensing element.

5. The pressure sensor module as defined in claim 4 , wherein the first member comprises a sensor cell comprising electrical circuitry and connected to the second member, wherein the pressure sensing element is located on the sensor cell.

6. The pressure sensor module as defined in claim 4 , wherein the base structure further comprises a housing connected to the second member.

7. A method of forming a stress isolated pressure sensor module comprising the steps of:

providing a base structure;

applying an adhesive layer to a portion of the base structure; and

adhering a pressure sensor comprising a pressure sensing element onto the base structure via the adhesive layer, wherein the pressure sensor is adhered onto a portion of the base structure to create an isolation gap between a remaining portion of the pressure sensor, wherein the cantilever member is formed by the isolation gap so that the cantilever member provides stress isolation to the pressure sensing element.

8. The method as defined in claim 7 , wherein the step of providing a base structure comprises forming a first member on top of a second member, wherein the pressure sensing element is disposed on the first member.

9. The method as defined in claim 8 , wherein the first member is adhered to only a portion of the second member such that the isolation gap is formed between the first and second members and the first member forms the cantilever member.