Semiconductor apparatus with thin semiconductor film
View Patent ↗A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.
1. A semiconductor apparatus comprising:
a substrate having at least one terminal;
a semiconductor film including at least one semiconductor device and a light passing surface, through which light emitted from the semiconductor device passes, the semiconductor film being disposed and closely bonded on the substrate, wherein an opposite side of the semiconductor film from the light passing surface is closely bonded to a surface of the substrate; and
an individual interconnecting line formed as a conductive film extending from the semiconductor device on the light passing surface of the semiconductor film to the terminal on the substrate, electrically connecting the semiconductor device to the terminal.