Magnetic memory device and method of manufacturing the same
View Patent ↗A method of manufacturing a magnetic memory device includes forming an insulation layer on a substrate, forming a lower electrode on the insulation layer, forming a magneto-resistive film on an upper surface of the lower electrode, the magneto-resistive film including an insulation barrier layer and a plurality of magnetic films stacked on both sides of the insulation barrier layer, stacking a mask layer on the magneto-resistive film, performing ion etching on the magneto-resistive film, using the mask layer as a mask, thereby forming a magneto-resistive element, forming an insulation film on upper surfaces of the mask, the magneto-resistive element and the lower electrode, and etching the insulation film with an ion beam such that a side surface of the magneto-resistive element is exposed.
1. A magnetic memory device comprising:
a substrate; and
a wiring layer formed on the substrate,
wherein the wiring layer includes a lower electrode, a magneto-resistive element formed on the lower electrode and configured to include an insulation barrier layer, at least one contact layer stacked on the magneto-resistive element, and an upper wiring connected to the contact layer, and a taper angle of a side surface of the magneto-resistive element including the insulation barrier layer, relative to a bottom surface of the magneto-resistive element, is about 60° or less.
2. The magnetic memory device according to claim 1 , wherein the contact layer and the magneto-resistive element are formed in a self-alignment manner.
3. The magnetic memory device according to claim 1 , further comprising a mask formed adjacent to the magneto-resistive element on the lower electrode.
4. The magnetic memory device according to claim 1 , wherein the contact layer has a greater taper angle than the taper angle of the magneto-resistive element.
5. The magnetic memory device according to claim 1 , wherein the magneto-resistive element includes an insulation barrier layer and at least two magnetic layers formed on both sides of the insulation barrier layer, the insulation barrier layer and the at least two magnetic layers having substantially equal etching rates with respect to an ion beam used for etching.
6. The magnetic memory device according to claim 1 , wherein a junction resistance per unit area of the magneto-resistive element is 10 6 Ω·μm 2 .
7. A magnetic memory device comprising:
a substrate; and
a wiring layer formed on the substrate,
wherein the wiring layer includes a lower electrode, a magneto-resistive element formed on the lower electrode and configured to include an insulation barrier layer, at least one contact layer stacked on the magneto-resistive element, and an upper wiring connected to the contact layer, and
the magneto-resistive element has an inclined side surface which is cleaned by ion beam etching after the magneto-resistive element is formed by ion beam etching.
8. The magnetic memory device according to claim 7 , wherein the cleaned inclined side surface is an exposed surface obtained by etching away an insulation film which is provided to cover an entirety of the magneto-resistive element after the magneto-resistive element is formed by the ion beam etching.
9. A magnetic memory device comprising:
a substrate; and
a wiring layer formed on the substrate,
wherein the wiring layer includes a lower electrode, a magneto-resistive element formed on the lower electrode and configured to include an insulation barrier layer, at least one contact layer stacked on the magneto-resistive element, and an upper wiring connected to the contact layer, and
an insulation film, which is provided to cover an entirety of the magneto-resistive element after the magneto-resistive element is formed by ion beam etching, is formed of a material that is more easily oxidizable than the lower electrode.
10. The magnetic memory device according to claim 9 , wherein the magneto-resistive element has an inclined side surface which is cleaned by ion beam etching after the magneto-resistive element is formed by ion beam etching,
the cleaned inclined side surface is an exposed surface obtained by etching away an insulation film which is provided to cover an entirety of the magneto-resistive element after the magneto-resistive element is formed by the ion beam etching, and
a recess is formed due to over-etching by the ion beam when the magneto-resistive element is formed by the ion beam etching.
11. The magnetic memory device according to claim 7 , wherein the magneto-resistive element includes an insulation barrier layer and at least two magnetic layers formed on both sides of the insulation barrier layer, the insulation barrier layer and the at least two magnetic layers having substantially equal etching rates with respect to an ion beam used for etching.
12. The magnetic memory device according to claim 9 , wherein the magneto-resistive element includes an insulation barrier layer and at least two magnetic layers formed on both sides of the insulation barrier layer, the insulation barrier layer and the at least two magnetic layers having substantially equal etching rates with respect to an ion beam used for etching.