IP Library Granted Patent US 7,857,510
Granted Patent B2
US 7,857,510 · App. 10/704,368 · Granted Dec 28, 2010

Temperature sensing circuit

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Quick Facts
Patent No.
US 7,857,510
App. No.
10/704,368
Granted
Dec 28, 2010
Kind
B2
Abstract

A temperature sensor, in accordance with the principles of the invention comprises a silicon substrate. The silicon substrate includes a bandgap, an offset circuit for providing calibration offsets, and a gain block for providing an output that varies substantially linearly with changes in temperature of the substrate.

Claims (28)

1. A temperature sensor, comprising:

a bandgap circuit comprising a first transistor and a second transistor, wherein the first transistor includes a terminal configured to have a voltage indicative of a temperature of a substrate;

a gain circuit comprising first and second input terminals and configured to provide an output that varies substantially linearly with changes in the temperature of the substrate, wherein the first input terminal is coupled to the terminal of the first transistor such that a voltage of the first input terminal is proportional to the voltage of the terminal of the first transistor; and

an offset circuit coupled to the second input terminal of the gain circuit, to the terminal of the first transistor, and to a terminal of the second transistor, wherein the offset circuit is configured to output an offset voltage to the second input terminal of the gain circuit, and wherein the offset voltage is proportional to a difference between the voltage of the terminal of the first transistor and a voltage of the terminal of the second transistor.

2. The temperature sensor of claim 1 , wherein the bandgap circuit further comprises a first amplifier, and wherein the gain circuit further comprises a second amplifier.

3. The temperature sensor of claim 2 , wherein the first amplifier comprises an output terminal, and wherein the output terminal is coupled to the second amplifier.

4. The temperature sensor of claim 3 , wherein the first amplifier further comprises a first input terminal and a second input terminal, wherein the first transistor is coupled to the first input terminal of the first amplifier, and wherein the second transistor is coupled to the second input terminal of the first amplifier.

5. The temperature sensor of claim 4 , wherein a voltage at the output terminal is proportional to a voltage differential between the first input terminal of the first amplifier and the second input terminal of the first amplifier.

6. The temperature sensor of claim 5 , wherein the output terminal is coupled to the offset circuit such that a voltage at an input terminal of the offset circuit is substantially equal to the voltage at the output terminal.

7. The temperature sensor of claim 1 , wherein the offset circuit comprises a voltage divider.

8. A temperature sensor, comprising:

a bandgap circuit comprising a first transistor and a second transistor;

a gain circuit comprising first and second input terminals and configured to provide an output that varies substantially linearly with changes in the temperature of a substrate, wherein the first input terminal of the gain circuit is coupled to the first transistor; and

an offset circuit coupled to the second input terminal of the gain circuit, to the first transistor, and to the second transistor such that the offset circuit provides a offset voltage to the second input terminal of the gain circuit that is proportional to a voltage differential between the first transistor and the second transistor.

9. The temperature sensor of claim 8 , wherein the bandgap circuit further comprises a first amplifier, and wherein the gain circuit further comprises a second amplifier.

10. The temperature sensor of claim 9 , wherein the first amplifier is coupled to the first and second transistors and comprises a first amplifier output terminal that is coupled to the offset circuit.

11. The temperature sensor of claim 10 , wherein a voltage of a first transistor terminal of the first transistor is configured to be indicative of a temperature of a substrate of the bandgap circuit, and wherein the first input terminal of the gain circuit is coupled to the first transistor terminal such that a voltage of the first input terminal is configured to be indicative of the temperature of the substrate.

12. The temperature sensor of claim 11 , wherein the second amplifier comprises first and second input terminals and a second amplifier output terminal, wherein the first and second input terminals of the second amplifier are differential inputs and a voltage of the second amplifier output terminal is configured to be indicative of the difference between a voltage of the first input terminal of the second amplifier and a voltage of the second input terminal of the second amplifier.

13. A temperature sensor, comprising:

a bandgap circuit comprising a first transistor and a second transistor, wherein the first transistor includes an output configured to be indicative of a temperature of a substrate at a first terminal;

an offset circuit connected to the first terminal of the first transistor and to a terminal of the second transistor via a first resistive path, wherein the offset circuit is configured to output an offset voltage proportional to a difference between a voltage of the first transistor and a voltage of the second transistor; and

a gain circuit comprising first and second input terminals, wherein the first input terminal of the gain circuit is connected to the terminal of the first transistor via a second resistive path and the second input terminal of the gain circuit is connected to the offset circuit via a third resistive path.

14. The temperature sensor of claim 13 , wherein the second resistive path comprises a buffer, wherein the emitter of the first transistor is connected to the buffer, and wherein the first input terminal of the gain circuit is connected to the buffer.

15. The temperature sensor of claim 13 , wherein the offset circuit is further connected to the emitter of the first transistor and to an emitter of the second transistor via the first resistive path.

16. A temperature sensor, comprising:

a bandgap circuit comprising a first transistor and a second transistor, wherein the first transistor includes a terminal configured to have a voltage indicative of a temperature of a substrate;

a gain circuit comprising first and second input terminals and configured to provide an output that varies substantially linearly with changes in the temperature of the substrate, wherein the first input terminal is connected to the terminal of the first transistor; and

an offset circuit connected to the second input terminal of the gain circuit, to the terminal of the first transistor, and to a terminal of the second transistor, wherein the offset circuit is configured to output an offset voltage to the second input terminal of the gain circuit, and wherein the offset voltage is proportional to a difference between the voltage of the terminal of the first transistor and a voltage of the terminal of the second transistor.

Assignments (16)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2023
From: MIND FUSION, LLC
To: THINKLOGIX, LLC
Reel/Frame 064357/0554 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →
SECURITY INTEREST Recorded Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2023
From: OL SECURITY LIMITED LIABILITY COMPANY
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062756/0114 →
MERGER Recorded Dec 22, 2015
From: DOLPAN AUDIO, LLC
To: OL SECURITY LIMITED LIABILITY COMPANY
Reel/Frame 037347/0184 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2008
From: ANDIGILOG, INC.
To: DOLPAN AUDIO, LLC
Reel/Frame 021687/0569 →
RELEASE OF SECURITY INTEREST Recorded Jun 23, 2008
From: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.; OM ANDIGILOG INVESTORS II, LLC; VENTURE LENDING & LEASING IV, LLC; LIEPOLD, CARL F
To: ANDIGILOG, INC.
Reel/Frame 021127/0792 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2008
From: VENTURE LENDING & LEASING IV, INC.
To: ANDIGILOG, INC.
Reel/Frame 021018/0454 →
RELEASE OF SECURITY INTEREST Recorded May 21, 2008
From: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.; OM ANDIGILOG INVESTORS II, LLC
To: ANDIGILOG, INC.
Reel/Frame 020976/0327 →
SECURITY AGREEMENT Recorded Mar 13, 2008
From: ANDIGILOG, INC.
To: VALLEY VENTURES III, L.P.; VALLEY VENTURES III ANNEX, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; INLIGN CP IV, LLC; DINES TRUST, DATED 12/99; GORDON, MARK; BONHAM, ALEX
Reel/Frame 020645/0218 →
SECURITY AGREEMENT Recorded Nov 7, 2006
From: ANDIGILOG, INC.
To: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.; OM ANDIGILOG INVESTORS II, LLC; VENTURE LENDING & LEASING IV, LLC; LIEPOLD, CARL F
Reel/Frame 018490/0055 →
SECURITY AGREEMENT Recorded Jul 26, 2006
From: ANDIGILOG, INC.
To: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.; OM ANDIGILOG INVESTORS II, LLC
Reel/Frame 017996/0519 →
RELEASE OF SECURITY INTEREST Recorded Mar 1, 2006
From: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.
To: ANDIGILOG, INC.
Reel/Frame 017230/0862 →
SECURITY AGREEMENT Recorded Oct 11, 2005
From: ANDIGILOG, INC.
To: VENTURE LENDING & LEASING IV, INC.
Reel/Frame 017065/0592 →
SECURITY AGREEMENT Recorded Jun 17, 2005
From: ANDIGILOG, INC.
To: VALLEY VENTURES III, L.P.; MISSION VENTURES II, L.P.; MISSION VENTURES AFFILIATES II, L.P.; PALISADES VENTURES, L.P.; PALISADES QUALIFIED INVESTORS, L.P.; PALISADES NON-QUALIFIED INVESTORS, L.P.
Reel/Frame 016153/0080 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2004
From: LIEPOLD, CARL F.; AYKROYD, CRAIG M.; MCLIN, JONATHAN DANIEL
To: ANDIGILOG, INC.
Reel/Frame 015049/0181 →