Switching assembly
View Patent ↗A switch assembly and method includes a heat sink with two switch modules coupled thereto. Both of the switch modules are used in switching operations to make use of the entire heat sink, providing improved heat dissipation. The switch modules each have first and second switch devices, with each switch device having a gate terminal. A source voltage is applied to the switching modules and a positive portion of the source voltage is conducted through one switch device of the first switching module. A negative portion of the source voltage is conducted through one of the switching devices of the second switching module.
1. A switch assembly, comprising:
a heat sink;
a first switch module connected to the heat sink, the first switch module having first and second switch devices, each switch device having a gate terminal;
a second switch module connected to the heat sink, the second switch module having first and second switch devices, each switch device having a gate terminal;
a first power source input terminal connected to a cathode terminal of the second switching device of the first switch module and an anode terminal of the first switching device of the second switch module; and
an output terminal connected to an anode terminal of the second switching device of the first switch module and a cathode terminal of the first switching device of the second switch module;
wherein the gate terminals of the switching devices are controllable such that the first switch module conducts during a first portion of the power duty cycle and the second switch module conducts during a second portion of the power duty cycle.
2. The switch assembly of claim 1 , further comprising a second power source input terminal connected to an anode terminal of the first switching device of the first switch module and a cathode terminal of the second switching device of the second switch module.
3. The switch assembly of claim 1 , wherein the first and second switch modules are connected to the heat sink via a compression bond.
4. The switch assembly of claim 1 , wherein the switch devices comprise SCRs.
5. A method of operating switching modules coupled to a common heat sink, each of the switching modules having first and second switch devices, the method comprising:
applying a source voltage to the switching modules;
conducting a positive portion of the source voltage through the second switch device of the first switching module; and
conducting a negative portion of the source voltage through the first switch device of the second switching module.
6. The method of claim 5 , further comprising applying a second source voltage to the switching modules.