IP Library Granted Patent US 6,992,554
Granted Patent B2
US 6,992,554 · App. 10/707,234 · Granted Jan 31, 2006

Data transmission element for downhole drilling components

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Quick Facts
Patent No.
US 6,992,554
App. No.
10/707,234
Granted
Jan 31, 2006
Kind
B2
Abstract

A robust data transmission element for transmitting information between downhole components, such as sections of drill pipe, in the presence of hostile environmental conditions, such as heat, dirt, rocks, mud, fluids, lubricants, and the like. The data transmission element components include a generally U-shaped annular housing, a generally U-shaped magnetically conductive, electrically insulating element such as ferrite, and an insulated conductor. Features on the magnetically conducting, electrically insulating element and the annular housing create a pocket when assembled. The data transmission element is filled with a polymer to retain the components within the annular housing by filling the pocket with the polymer. The polymer can bond with the annular housing and the insulated conductor but preferably not the magnetically conductive, electrically insulating element. A data transmission element is mounted within a recess proximate a mating surface of a downhole drilling component, such as a section of drill pipe.

Claims (28)

1. A data transmission element for downhole components, comprising:

a generally U-shaped annular housing having an inner wall undercut proximate its open end;

a generally U-shaped MCEI element comprising an inner wall, an outer wall; and an open end, an outer wall recess proximate the open end and an inner wall protrusion defining the open end;

the MCEI element being disposed within the annular housing such that the inner wall of the annular housing and the outer wall of the MCEI element form a gap and the recess is generally opposite the undercut forming a pocket wider than the gap there between;

an insulated conductor being disposed within the MCEI element;

wherein the gap, the pocket, and the MCEI element are filled with a polymer such that the polymer affixes the MCEI element within the generally U-shaped annular housing and the insulated conductor within the MCEI element.

2. The data transmission element of claim 1 , wherein the polymer is a thermoplastic material.

3. The data transmission element of claim 2 , wherein the thermoplastic material is a fluoropolymer.

4. The data transmission element of claim 3 , wherein the fluropolymer is Teflon®.

5. The data transmission element of claim 4 wherein the Teflon® material is chosen from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

6. The data transmission element of claim 1 wherein the polymer bonds to the annular housing.

7. The data transmission element of claim 1 , wherein the polymer bonds to the insulated conductor.

8. The data transmission element of claim 1 , wherein the polymer does not bond to the MCEI element.

9. The data transmission element of claim 1 wherein the insulated conductor has a diameter that is larger than the open end of the MCEI element.

10. The data transmission element of claim 1 wherein the conductor material of the insulated conductor is selected from the group consisting of copper, copper clad steel, silver plated copper clad steel, nickel plated copper clad steel, copper clad stainless steel, silver plated copper clad stainless steel, and nickel plated copper clad stainless steel.

11. The data transmission element of claim 1 wherein the insulating material of the insulated conductor is bonded to the conductor.

12. The data transmission element of claim 1 wherein the insulating material of the insulated conductor is a polymer.

13. The data transmission element of claim 12 wherein the polymer is a thermoplastic material.

14. The data transmission element of claim 13 , wherein the thermoplastic material is a fluoropolymer.

15. The data transmission element of claim 14 wherein the fluoropolymer material is Teflon®.

16. The data transmission element of claim 15 wherein the Teflon® is chosen from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

17. The data transmission element of claim 1 wherein the MCEI element is segmented.

18. The data transmission element of claim 1 wherein the MCEI element has a plurality of outer wall recesses.

19. The data transmission element of claim 18 wherein the plurality of outer wall recesses form barbs.

20. The data transmission element of claim 1 wherein the MCEI element is constructed of ferrite.

21. The data transmission element of claim 1 wherein the generally U-shaped annular housing is made of metal.

22. The data transmission element of claim 21 wherein the metal is selected from the group consisting of steel, titanium, chrome, nickel, aluminum, iron, copper, tin, and lead.

23. The data transmission element of claim 22 wherein the steel is selected from the group consisting of viscount 44, D2, stainless steel, tool steel, and 4100 series steels.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2010
From: INTELLISERV, INC.
To: INTELLISERV, LLC
Reel/Frame 023750/0965 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2009
From: INTELLISERV INTERNATIONAL HOLDING LTD
To: INTELLISERV, INC
Reel/Frame 023660/0274 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2007
From: INTELLISERV, INC.
To: INTELLISERV INTERNATIONAL HOLDING, LTD.
Reel/Frame 020279/0455 →
RELEASE OF PATENT SECURITY AGREEMENT Recorded Sep 18, 2006
From: WELLS FARGO BANK
To: INTELLISERV, INC.
Reel/Frame 018268/0790 →
PATENT SECURITY AGREEMENT SUPPLEMENT Recorded Dec 15, 2005
From: INTELLISERV, INC.
To: WELLS FARGO BANK
Reel/Frame 016891/0868 →
CONFIRMATORY LICENSE Recorded Mar 24, 2005
From: NOVATEK
To: ENERGY, UNITED STATES DEPARTMENT OF
Reel/Frame 016388/0966 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2004
From: NOVATEK, INC.
To: INTELLISERV, INC.
Reel/Frame 014718/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2004
From: HALL, DAVID R.; HALL, JR., H. TRACY; PIXTON, DAVID S.
To: NOVATEK, INC.
Reel/Frame 014613/0094 →