IP Library Granted Patent US 6,861,910
Granted Patent B2
US 6,861,910 · App. 10/707,884 · Granted Mar 1, 2005

Multistage amplifier and integrated circuit

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Quick Facts
Patent No.
US 6,861,910
App. No.
10/707,884
Granted
Mar 1, 2005
Kind
B2
Abstract

An initial-stage amplifier 1 that deals with microsignals and other amplifiers 2 and 3 separate a power source line, and both separated power source lines 4 and 8 are commonly connected to a power source pad 6 . This enables avoidance of the occurrence of a large potential difference between the initial-stage amplifier 1 and other amplifiers 2 and 3 due to differences in currents pulled to the amplifiers 1 to 3 , and can prevent the occurrence of noise arising from such potential difference. Also, feedback loops are differentiated by the initial-stage amplifier 1 and other amplifiers 2 and 3 . This can also prevent unfavorable effects where a large signal would be fed back from the rear-stage amplifiers 2 and 3 to the initial-stage amplifier 1.

Claims (25)

1. A multistage amplifier, comprising:

a plurality of amplifiers that are constructed in a cascade connection manner so as to amplify an input signal from a previous stage and output the amplified signal to a following stage; and

a ground line connected to said plurality of amplifiers;

wherein substrates held by said plurality or amplifiers are each individually connected to said ground line.

2. A multistage amplifier, comprising:

a plurality of amplifiers that are constructed in a cascade connection manner so as to amplify an input signal from a previous stage and output the amplified signal to a following stage;

a power source line connected to said plurality of amplifiers; and

a ground line connected to said plurality of amplifiers;

wherein said power source line has a first power source line connected to at least the initial-stage amplifier from among said plurality of amplifiers, and a second power source line commonly connected to the remaining amplifiers except for at least said initial-stage amplifier;

wherein substrates held by said plurality of amplifiers are each individually connected to said ground line.

3. The multistage amplifier according to claim 2 , wherein said ground line has a first ground line connected to at least said initial-stage amplifier, and a second ground line commonly connected so the remaining amplifiers except for at least said initial-stage amplifier.

4. An integrated circuit, comprising:

a plurality of amplifiers that are constructed in a cascade connection manner so as to amplify an input signal from a previous stage and output the amplified signal to a following stage;

a ground line connected to said plurality of amplifiers; and

a ground pad connected to said ground line;

wherein substrates held by said plurality of amplifiers are each individually connected to said ground line.

5. An integrated circuit, comprising:

a plurality of amplifiers that are constructed in a cascade connection manner so as to amplify an input signal from a previous stage and output the amplified signal to a following stage;

a power source line connected to said plurality of amplifiers;

a ground line connected to said plurality of amplifiers;

a power source pad connected to said power source line; and

a ground pad connected to said ground line;

wherein said power source line has a first power source line connected between at least the initial-stage amplifier from among said plurality of amplifiers and said power source pad, and a second power source line commonly connected between the remaining amplifiers except for at least said initial-stage amplifier and said power source pad;

wherein substrates held by said plurality of amplifiers are each individually connected to said around line.

6. The integrated circuit according to claim 5 , wherein said ground line has a first ground line connected between at feast said initial-stage amplifier and said ground pad, and a second ground line commonly connected between the remaining amplifiers except for at least said initial-stage amplifier and said ground pad.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2015
From: RICOH COMPANY, LTD.
To: RICOH ELECTRONIC DEVICES CO., LTD.
Reel/Frame 035011/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2009
From: NSC CO., LTD.
To: RICOH CO., LTD.
Reel/Frame 023449/0462 →
CHANGE OF NAME Recorded Sep 16, 2009
From: NIIGATA SEIMITSU CO., LTD.
To: NSC CO., LTD.
Reel/Frame 023240/0899 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEES PREVIOUSLY RECORDED ON REEL 019890 FRAME 0858. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE TO BOTH RICOH CO., LTD. AND NIIGATA SEIMITSU CO., LTD. EQUALLY SHARING RIGHTS (50/50). Recorded Oct 7, 2008
From: NIIGATA SEIMITSU CO., LTD.
To: NIIGATA SEIMITSU CO., LTD.; RICOH CO., LTD.
Reel/Frame 021642/0242 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2007
From: NIIGATA SEIMITSU CO., LTD.
To: RICOH CO. LTD.
Reel/Frame 019890/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2004
From: KARASUDANI, MUNEHIRO
To: NIIGATA SEIMITSU CO., LTD.
Reel/Frame 014275/0426 →