METHOD OF FORMING BIPOLAR PLATE MODULES
A bipolar plate module includes an anode, a cathode and a membrane electrode assembly (MEA) disposed therebetween. A sealing material forms a sealing layer between the plates and encapsulates a portion of the MEA. A method of manufacturing involves injection of the sealing material into a groove of the anode plate and through a through-hole disposed within the groove. The sealing material fills the space between the anode and cathode to form the sealing layer and encapsulates the portion of the MEA to form the edge seal. Further, material injected on the outer surface of the anode forms an insulation layer when compressed. An alternate method includes utilizing a screen printing technique to deposit the material upon the anode, placing the MEA and cathode in their proper positions, and then curing the material to form the sealing layer and to form an edge seal about the portion of the MEA.
1 . A method of manufacturing a bipolar plate module comprising an anode plate, a cathode plate, and a membrane electrode assembly (mea) disposed between the anode plate and the cathode plate, the method steps comprising the steps of:
placing the anode plate, the cathode plate and the MEA within a mold;
injecting a sealing material into the mold, whereby the seal material fills grooves formed on the anode or cathode plates to form an insulation layer, the material flows through through-holes formed in the grooves of either the anode plate or the cathode plate to form a sealing layer between the plates and to form an edge seal about a portion of the MEA; and
curing the sealing material to bind the anode plate to the cathode plate, thereby forming a bipolar plate module.
2 . A method of manufacturing a bipolar plate module according to claim 1 , wherein the sealing material comprises a silicone material.
3 . A method of manufacturing a bipolar plate module according to claim 1 , wherein the sealing material is epoxy nitrile.
4 . A method of manufacturing a bipolar plate module according to claim 1 , wherein the pressure for injecting the sealing material is between about 300-700 lb/in 2 .
5 . A method of manufacturing a bipolar plate module according to claim 1 , wherein said temperature of the sealing material when injected into the mold is between about 75-400 degrees Fahrenheit.
6 . A method of manufacturing a bipolar plate module according to claim 1 , wherein said curing step includes applying pressure to the anode and cathode plates.
7 . A method of manufacturing a bipolar plate module comprising an anode plate, a cathode plate, and a membrane electrode assembly (MEA) disposed between the anode plate and the cathode plate, the method comprising the steps of:
screen printing a sealing material upon one of a anode plate and a cathode plate;
positioning the MEA upon one of the anode plate and the cathode plate;
placing the other one of the anode plate and cathode plate upon the MEA;
curing the sealing material to form a sealing layer between the anode and cathode plates and to form an edge seal about a portion of the MEA, thereby binding the anode plate to the cathode plate to form a bipolar plate module.
8 . A method of manufacturing a bipolar plate module according to claim 7 , wherein the sealing material is deposited upon a perimeter of the anode or cathode plate.
9 . A method of manufacturing a bipolar plate module according to claim 7 , wherein the sealing material comprises a silicone material.
10 . A method of manufacturing a bipolar plate module according to claim 7 , wherein the sealing material is epoxy nitrile.
11 . A method of manufacturing a bipolar plate module according to claim 7 , wherein the step of positioning the MEA upon one of the anode plate and the cathode plate is performed before said screen-printing step.
12 . A method of manufacturing a bipolar plate module according to claim 7 , further including the step of forming an insulation layer between two bipolar plate modules.
13 . A method of manufacturing a bipolar plate module according to claim 12 , wherein the sealing material fills grooves formed on the anode plate and cathode plate to form the insulation layer.
14 . A method of manufacturing a bipolar plate module according to claim 7 , wherein said curing step includes applying pressure to the anode and cathode plates.