IP Library Granted Patent US 7,040,003
Granted Patent B2
US 7,040,003 · App. 10/708,845 · Granted May 9, 2006

Inductive coupler for downhole components and method for making same

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Quick Facts
Patent No.
US 7,040,003
App. No.
10/708,845
Granted
May 9, 2006
Kind
B2
Abstract

The present invention includes a method of making an inductive coupler for downhole components. The method includes providing an annular housing, preferably made of steel, the housing having a recess. A conductor, preferably an insulated wire, is also provided along with a plurality of generally U-shaped magnetically conducting, electrically insulating (MCEI) segments. Preferably, the MCEI segments comprise ferrite. An assembly is formed by placing the plurality of MCEI segments within the recess in the annular housing. The segments are aligned to form a generally circular trough. A first portion of the conductor is placed within the circular trough. This assembly is consolidated with a meltable polymer which fills spaces between the segments, annular housing and the first portion of the conductor. The invention also includes an inductive coupler including an annular housing having a recess defined by a bottom portion and two opposing side wall portions. At least one side wall portion includes a lip extending toward but not reaching the other side wall portion. A plurality of generally U-shaped MCEI segments, preferably comprised of ferrite, are disposed in the recess and aligned so as to form a circular trough. The coupler further includes a conductor disposed within the circular trough and a polymer filling spaces between the segments, the annular housing and the conductor.

Claims (38)

1. A method of making an inductive coupler for downhole components, comprising the steps of:

providing an annular housing having a recess; a conductor; and a plurality of generally U-shaped MCEI segments;

forming an assembly by placing the plurality of MCEI segments within the recess in the annular housing, wherein said segments are aligned to form a generally circular trough and placing a first portion of the conductor within the circular trough;

consolidating the assembly with a meltable polymer to thereby fill spaces between the segments, annular housing and the first portion of the conductor.

2. The method of claim 1 wherein the annular housing defines an opening therethrough which communicates with the recess, and wherein a second portion of the conductor passes through the opening.

3. The method of claim 1 wherein the annular housing is electrically conducting.

4. The method of claim 3 wherein an end of the conductor is electrically connected to the annular housing.

5. The method of claim 4 wherein an end of the first portion of the conductor is attached to the annular housing by welding.

6. The method of claim 4 wherein an end of the first portion of the conductor is attached to the annular housing by brazing.

7. The method of claim 1 wherein the assembly further comprises a meltable polymer liner located in the recess, and wherein the assembly is consolidated by applying sufficient heat to at least partially melt the liner.

8. The method of claim 7 wherein the annular housing defines an opening therethrough which communicates with the recess, wherein a second portion of the conductor passes through the opening, wherein the segments are arranged so as to provide a gap therebetween adjacent the opening; and wherein the liner is likewise arranged so as to provide a gap adjacent the opening.

9. The method of claim 7 wherein the liner comprises a fluoropolymer.

10. The method of claim 9 wherein the fluoropolymer is chosen from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

11. The method of claim 1 wherein the assembly further comprises a generally circular, meltable polymer cap located adjacent the circular trough formed by the plurality of MCEI segments, and wherein the assembly is consolidated by applying sufficient heat to at least partially melt the cap.

12. The method of claim 1 wherein the cap includes a protrusion that fits within the trough.

13. The method of claim 11 wherein the meltable cap comprises a fluoropolymer.

14. The method of claim 13 wherein the fluoropolymer is chosen from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

15. The method of claim 1 wherein the consolidating step comprises infusing a meltable polymer from outside the assembly.

16. The method of claim 15 wherein the meltable polymer comprises a fluoropolymer selected from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

17. The method of claim 1 wherein the meltable polymer is raised to a temperature between the range of about 250° C. and 450° C. during the consolidating step.

18. The method of claim 17 wherein the temperature is about 330° C.

19. The method of claim 1 wherein pressure is applied to the assembly during the consolidating step.

20. The method of claim 19 wherein the pressure is between about 20 psi and about 150 psi.

21. The method of claim 20 wherein the pressure is about 100 psi.

22. The method of claim 1 wherein the MCEI segments comprise ferrite.

23. The method of claim 1 wherein the conductor comprises a material selected from the group consisting of copper, copper clad steel, silver plated copper clad steel, nickel plated copper clad steel, copper clad stainless steel, silver plated copper clad stainless steel, and nickel plated copper clad stainless steel.

24. The method of claim 1 wherein the conductor is an insulated wire.

25. A method of making an inductive coupler for downhole components, comprising the steps of:

providing an annular housing having a recess, an insulated wire, a plurality of generally U-shaped MCEI segments, a meltable polymer liner and a circular, meltable polymer cap;

forming an assembly by placing the liner within the recess,

placing the plurality of MCEI segments on top of the liner, wherein said segments are aligned to form a circular trough,

placing a first portion of the insulated wire within the circular trough, and

placing the cap on top of the MCEI segments; and

consolidating the assembly by applying sufficient heat to at least partially melt the liner and the cap, to thereby fill spaces between the segments, annular housing and the first portion of the insulated wire.

26. The method of claim 24 wherein the insulating material of the insulated wire is bonded to the wire.

27. The method of claim 26 wherein the wire is insulated with a thermoplastic polymer.

28. The method of claim 27 wherein the thermoplastic polymer is a fluoropolymer.

29. The method of claim 28 wherein the fluoropolymer is chosen from the group consisting of PFA, FEP, ETFE, AF, PTFE, and ECTFE.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2010
From: INTELLISERV, INC.
To: INTELLISERV, LLC
Reel/Frame 023750/0965 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2009
From: INTELLISERV INTERNATIONAL HOLDING LTD
To: INTELLISERV, INC
Reel/Frame 023660/0274 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 21, 2007
From: INTELLISERV, INC.
To: INTELLISERV INTERNATIONAL HOLDING, LTD.
Reel/Frame 020279/0455 →
RELEASE OF PATENT SECURITY AGREEMENT Recorded Sep 18, 2006
From: WELLS FARGO BANK
To: INTELLISERV, INC.
Reel/Frame 018268/0790 →
PATENT SECURITY AGREEMENT SUPPLEMENT Recorded Dec 15, 2005
From: INTELLISERV, INC.
To: WELLS FARGO BANK
Reel/Frame 016891/0868 →
CONFIRMATORY LICENSE Recorded Mar 24, 2005
From: NOVATEK
To: ENGERY, UNITED STATES DEPARTMENT OF
Reel/Frame 016388/0963 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2004
From: NOVATEK, INC.
To: INTELLISERV, INC.
Reel/Frame 014718/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2004
From: HALL, DAVID R.; HALL, H. TRACY JR.; PIXTON, DAVID S.; BRISCOE, MICHAEL; DAHLGREN, SCOTT; SNEDDON, CAMERON; FOX, JOE
To: NOVATEK, INC.
Reel/Frame 014704/0905 →