METHOD OF FABRICATING DISPLAY PANEL

1 . A method of fabricating a display panel, the method comprising the steps of:

providing a substrate having a thin film transistor on the surface of the substrate;

forming a protection layer on the substrate;

forming a planarization layer on the protection layer;

patterning the planarization layer to form an opening;

performing an etching process by using the planarization layer as a mask to form a first contact hole in the protection layer extending through to the thin film transistor; and

partially removing the planarization layer surrounding each opening to enlarge the opening and form a second contact hole.

2 . The method of claim 1 wherein the planarization layer comprises a photoresist layer.

3 . The method of claim 1 wherein an exposure process and a development process are used to pattern the planarization layer.

4 . The method of claim 1 wherein a descum process is used to selectively remove parts of the planarization layer surrounding the openings.

5 . The method of claim 1 wherein the protection layer comprises a silicon nitride layer or a silicon oxide layer.

6 . The method of claim 1 further comprising depositing a conductive layer on the planarization layer, covering the first contact hole and the second contact hole and electrically connecting to the thin film transistor.

7 . The method of claim 6 wherein the conductive layer comprises indium tin oxide (ITO) or indium zinc oxide IZO.

8 . The method of claim 1 wherein the display panel is an organic light-emitting display panel or a liquid crystal display panel.

9 . A method of fabricating a display panel, comprising the steps of:

providing a substrate with a conductive area on the substrate;

forming a protection layer over the substrate;

forming a patterned photoresist layer with an opening formed on the conductive area;

performing an etching process by using the photoresist layer as a mask to form a first contact hole in the protection layer extending through to the conductive area;

partially removing the photoresist layer surrounding the opening to enlarge the opening and form a second contact hole next to the first contact hole; and

forming a conductive layer on the surface of the photoresist layer electrically connected to the conductive area through the first contact hole and the second contact hole.

10 . The method of claim 9 wherein the method of forming the patterned photoresist layer comprises:

forming a photoresist layer on the protection layer;

performing a exposure process to define patterns of the photoresist layer; and

performing a development process to form the opening in the photoresist layer.

11 . The method of claim 9 wherein the method uses a descum process to partially remove the photoresist layer surrounding the opening.

12 . The method of claim 9 wherein the protection layer comprises a silicon oxide layer or a silicon nitride layer.

13 . The method of claim 9 wherein the display panel is an organic light-emitting display panel or a liquid crystal display panel.

14 . A display panel fabricated in accordance with the method of claim 9 .

15 . A display device comprising:

a display panel of claim 14; and

a controller coupled to the display panel to control the display panel to render an image in accordance with an input.

16 . An electronic device comprising:

a display device of claim 15; and

an input device coupled to the controller of the display to render an image.