IP Library Granted Patent US 7,048,352
Granted Patent B2
US 7,048,352 · App. 10/713,064 · Granted May 23, 2006

Printhead supporting shell

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Quick Facts
Patent No.
US 7,048,352
App. No.
10/713,064
Granted
May 23, 2006
Kind
B2
Abstract

A printhead supporting shell ( 4 ) is provided for a pagewidth printhead assembly ( 1 ). The shell comprises a longitudinal laminated structure defining an interior space and formed from continuous layers of at least two materials ( 10,11 ). The layers are odd in number and disposed symmetrically about a central layer ( 10 ). In preferred embodiments, the supporting shell is adapted to a pagewidth printhead ( 12 ).

Claims (29)

1. A printhead supporting shell device for a pagewidth printhead assembly, the shell comprising:

a longitudinal laminated structure defining an interior space, formed from continuous layers of at least two materials;

the layers being odd in number and disposed symmetrically about a central layer.

2. A device according to claim 1 , wherein:

two layers which are symmetrically disposed about the central layer are made from the same material and have the same thickness.

3. A device according to claim 1 , wherein:

the shell further comprises a longitudinal gap adapted to receive a component of a printhead.

4. A device according to claim 1 , wherein:

the laminated shell is formed from at least three metals laminated together, the laminate having inner and outer layers which have the same coefficient of thermal expansion.

5. A device according to claim 1 , wherein:

the shell has outer layers which are made from invar.

6. A device according to claim 1 , wherein:

each material has a different coefficient of thermal expansion.

7. A device according to claim 6 , wherein:

at least two materials have coefficients of expansion which are different than the coefficient of expansion of silicon, one material having a coefficient of expansion which is greater than the coefficient of expansion of silicon and one material having a coefficient of expansion which is less than the coefficient of expansion of silicon.

8. A device according to claim 1 , wherein:

two layers which are symmetrically disposed about the central layer have different thicknesses, the lateral cross section of the shell, in compensation, being configured to prevent bowing.

9. A device according to claim 1 , wherein:

all of the layers are metal.

10. A device according to claim 1 , further comprising:

an extruded plastic core in which is formed one or more ink reservoirs.

11. A device according to claim 10 , wherein:

the reservoirs lead to a printhead which protrudes from the shell.

12. A device according to claim 11 , wherein:

the printhead is a modular printhead comprising a plurality of modules disposed along the length of the core.

13. A device according to claim 12 , wherein:

each module is fabricated from silicon.

14. A device according to claim 13 , wherein:

each module further comprises ink nozzles, chambers and actuators.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028543/0462 →