IP Library Granted Patent US 6,942,319
Granted Patent B2
US 6,942,319 · App. 10/713,067 · Granted Sep 13, 2005

Stable printhead assembly

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,942,319
App. No.
10/713,067
Granted
Sep 13, 2005
Kind
B2
Abstract

Disclosed is a stable printhead assembly ( 1 ) for carrying a printhead ( 2 ) such as modular MEMS printhead. The assembly has an elongated core ( 5 ) and for example, a MEMS printhead bonded to the core. The core is contained within an outer laminated shell ( 4 ). The shell and core together have an effective coefficient of thermal expansion substantially equal to that of the printhead.

Claims (42)

1. A printhead assembly for carrying a printhead, comprising:

an elongated core;

a MEMS printhead bonded to the core;

the core being contained within an outer laminated shell, the shell and core together having an effective coefficient of thermal expansion substantially equal to that of the printhead.

2. A printhead assembly according to claim 1 , wherein:

the outer shell is formed from different materials laminated together, the laminate having inner and outer layers which are of the same metal.

3. A printhead assembly according to claim 2 , wherein:

the laminated shell comprises inner and outer layers of invar.

4. A printhead assembly according to claim 1 , wherein:

the printhead is fabricated from silicon.

5. A printhead assembly according to claim 1 , wherein:

the outer shell has an odd number of longitudinally extending layers, being at least three in number, layers being arranged symmetrically about a central layer.

6. A printhead assembly according to claim 5 , wherein:

the laminated shell comprises two or more different materials, each having a different coefficient of thermal expansion.

7. A printhead assembly according to claim 1 , wherein:

a coefficient of thermal expansion of the core and a coefficient of thermal expansion of the shell are different.

8. A printhead assembly according to claim 1 , wherein:

the extrusion comprises adjacent reservoirs which collectively lead to an area adapted to receive a printhead which is carried by the core.

9. A printhead assembly according to claim 1 , wherein:

the core is an extruded and elongated body having a plurality of interior reservoirs, the reservoirs each having an ink exit opening, the openings converging into an area adapted to receive the printhead.

10. A printhead assembly according to claim 1 , wherein:

the body is a plastic extrusion.

11. A printhead assembly according to claim 10 , wherein:

the body is internally subdivided by extruded membranes to define the reservoirs.

12. A printhead assembly according to claim 11 , wherein:

the reservoirs are four in number.

13. A printhead assembly according to claim 1 , wherein:

the core is adapted to be encased by the shell, the body and shell.

14. A printhead assembly according to claim 13 , wherein:

the body includes a portion which protrudes beyond the shell, this portion receiving the printhead.

15. A printhead assembly according to claim 1 , wherein:

the core has a coefficient of expansion which is less than the coefficient of expansion of silicon, and the shell has a coefficient of expansion which is greater than the coefficient of expansion of silicon.

16. A printhead assembly according to claim 1 , wherein:

the shell comprises at least two materials bonded to one another and having coefficients of expansion which are different than the coefficient of expansion of silicon, one material having a coefficient of expansion which is greater than the coefficient of expansion of silicon and another material having a coefficient of expansion which is less than the coefficient of expansion of silicon.

17. A printhead assembly according to claim 1 , wherein:

the laminated shell comprises hot rolled layers of metal.

18. A printhead assembly according to claim 1 , further comprising:

a modular printhead bonded to the core, the printhead comprising a plurality of modules disposed along the core.

19. A printhead assembly according to claim 18 , wherein:

each module is fabricated from silicon.

20. A printhead assembly according to claim 19 , wherein:

each module further comprises a MEMS structure.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028539/0569 →