Fluid ejection device that incorporates covering formations for actuators of the fluid ejection device
View Patent ↗A micro-electromechanical fluid ejection device includes a substrate that incorporates drive circuitry. Nozzle chamber walls and a roof are positioned on the substrate to define a nozzle chamber with the roof defining a fluid ejection port in fluid communication with the nozzle chamber. A fluid-ejecting member is operatively positioned with respect to the nozzle chamber. The fluid-ejecting member is displaceable with respect to the substrate to eject fluid from the fluid ejection port. An actuator is connected to the fluid-ejecting member and to the drive circuitry. The actuator is displaceable upon receipt of an electrical signal from the drive circuitry to displace the fluid-ejecting member and thus eject fluid from the fluid ejection port. A covering formation is positioned on the substrate so that the substrate and the covering formation define an air chamber, the actuator being positioned within the air chamber.
1. A micro-electromechanical fluid ejection device that comprises
a substrate that incorporates drive circuitry;
nozzle chamber walls and a roof that are positioned on the substrate to define a nozzle chamber with the roof defining a fluid ejection port in fluid communication with the nozzle chamber;
a fluid-ejecting member that is operatively positioned with respect to the nozzle chamber, the fluid-ejecting member being displaceable with respect to the substrate to eject fluid from the fluid ejection port;
an actuator that is connected to the fluid-ejecting member and to the drive circuitry, the actuator being displaceable upon receipt of an electrical signal from the drive circuitry to displace the fluid-ejecting member and thus eject fluid from the fluid ejection port; and
a covering formation that is positioned on the substrate so that the substrate and the covering formation define an air chamber, the actuator being positioned within the air chamber.
2. A device as claimed in claim 1 , which is the product of an integrated circuit fabrication technique.
3. A device as claimed in claim 2 , in which the substrate includes a silicon wafer substrate, a CMOS drive circuitry layer positioned on the silicon wafer substrate and an ink passivation layer positioned on the CMOS drive circuitry layer.
4. A device as claimed in claim 3 , in which each fluid-ejecting member is positioned in its respective nozzle chamber and is displaceable towards and away from the fluid ejection port.
5. A device as claimed in claim 3 , in which each nozzle arrangement includes a work-transmitting structure that is displaceable with respect to the substrate and is connected to the fluid-ejecting member so that displacement of the work-transmitting structure results in displacement of the fluid-ejecting member, the actuator being connected to the work-transmitting structure to displace the work-transmitting structure.
6. A device as claimed in claim 5 , in which the roof, the work-transmitting structure and the covering formation together define a protective structure that is positioned in a common plane.
7. A device as claimed in claim 6 , in which the roof, the work-transmitting structure and the covering formation are configured so that the protective structure is unitary.
8. A device as claimed in claim 3 , in which a plurality of fluid inlet channels are defined through the substrate, with each fluid inlet channel opening into a respective nozzle chamber.