Structure to achieve high-Q and low insertion loss film bulk acoustic resonators
A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.
1. A film bulk acoustic resonator device formed on a substrate having a first opening therein, the film bulk acoustic resonator comprising:
a seed layer exposed about the periphery of the first opening, the seed layer having a second opening therein;
a layer of piezoelectric material spanning the second opening in the seed layer.
2. The film bulk acoustic resonator device of claim 1 wherein the first opening has a larger area near the layer of the piezoelectric material and a smaller area remote from the piezoelectric material.
3. The film bulk acoustic resonator device of claim 1 wherein the substrate further includes a major surface, the first opening further including at least one sidewall, the angle between the at least one sidewall and the major surface of the substrate at an angle other than perpendicular.
4. The film bulk acoustic resonator device of claim 1 wherein the seed layer is in a first plane and the layer of piezoelectric material is in a second plane.
5. The film bulk acoustic resonator device of claim 1 further including a conductive layer.
6. The film bulk acoustic resonator device of claim 5 wherein the seed layer is in a first plane, the layer of piezoelectric material is in a second plane, and at least a portion of the conductive layer is in a first plane.
7. The film bulk acoustic resonator device of claim 1 further comprising:
a first conductive layer; and
a second conductive layer, the first conductive layer deposited on a first surface of the piezoelectric material, and the second conductive layer deposited on a second surface of the layer of piezoelectric material.
8. The film bulk acoustic resonator device of claim 7 further comprising:
a first electrode; and
a second electrode, wherein the first conductive layer is a portion of the first electrode, and the second conductive layer is a portion of the second electrode.
9. The film bulk acoustic resonator device of claim 8 wherein at least one of the first electrode, and the second electrode has portions which are in different planes.
10. The film bulk acoustic resonator device of claim 8 wherein both the first electrode, and the second electrode have portions which are in different planes.
11. The film bulk acoustic resonator of claim 1 wherein the layer of piezoelectric material is a single-crystal film.
12. The film bulk acoustic resonator of claim 1 wherein the layer of piezoelectric material is AIN.
13. The film bulk acoustic resonator of claim 1 wherein the layer of piezoelectric material is ZnO.
14. The film bulk acoustic resonator of claim 1 wherein the layer of piezoelectric material is a C-axis orientated film.
15. The film bulk acoustic resonator of claim 1 wherein the layer of piezoelectric material includes:
a C-axis oriented portion; and
a non C-axis oriented portion, wherein at least a portion of the first conductive layer and a portion of the second conductive layer is proximate the C-axis oriented portion of the layer of piezoelectric material.
16. The film bulk acoustic resonator of claim 1 wherein the seed layer is nonconductive.
17. The film bulk acoustic resonator device of claim 7 further comprising a source of RF voltage attached between the first conductive layer and the second conductive layer.
18. The film bulk acoustic resonator device of claim 7 further comprising a source of RF voltage attached between the first electrode and the second electrode.
19. A film bulk acoustic resonator device formed on a substrate having an opening therein, the film bulk acoustic resonator comprising:
a seed layer exposed about the periphery of the opening; and
a layer of piezoelectric material spanning the remaining portion of the opening, wherein the layer of piezoelectric material includes:
a C-axis oriented portion; and
a non C-axis oriented portion, wherein at least a portion of the first conductive layer and a portion of the second conductive layer is proximate the C-axis oriented portion of the layer of piezoelectric material.