IP Library Granted Patent US 7,179,276
Granted Patent B2
US 7,179,276 · App. 10/722,335 · Granted Feb 20, 2007

Heated vascular occlusion coil deployment system

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Quick Facts
Patent No.
US 7,179,276
App. No.
10/722,335
Granted
Feb 20, 2007
Kind
B2
Abstract

An embolic coil deployment system for placing a coil at a preselected site within a vessel of the human body. The deployment system includes a heating element at the distal end of a delivery member and a heat responsive coupling for holding the coil during positioning of the coil and the heating element is heated to reduce the strength of the heat responsive coupling for releasing the coil at a desired position within the vessel.

Claims (14)

1. A vascular occlusion coil deployment system for use in placing a coil at a preselected site within a vessel comprising:

an elongated flexible positioning member having a lumen extending therethrough and having proximal and distal ends;

an embolic coil;

an elongated flexible delivery member having a lumen extending therethrough and being positioned within the lumen of the positioning member and having proximal and distal ends;

a heating element mounted on the distal end of the delivery member, said heating element being an electrically heated coil;

a non-optical energy transmission conductor extending along the lumen of the delivery member and extending from the proximal end to the distal end of the delivery member, said energy transmission conductor being coupled to said heating element; and

a unitary non-metallic heat responsive coupling member coupled directly to the heating element coil and normally retaining the embolic coil by an adhesive bond, said heat responsive coupling member comprises a biocompatible adhesive that exhibits the characteristic of, upon being heated, releasing the adhesive bond and the embolic coil at the preselected site, and wherein the yield strength of the biocompatible adhesive is reduced when heated by the heating element.

2. A vascular occlusion coil deployment system as defined in claim 1 , wherein said adhesive is a hot melt adhesive that is bonded to the embolic coil prior to exhibiting said characteristic of releasing upon being heated and wherein the yield strength is reduced at least 50 percent when heated to about 65 degrees Celsius.

3. A vascular occlusion coil deployment system as defined in claim 1 , wherein said adhesive is a hot melt adhesive polymer.

4. A vascular occlusion coil deployment system as defined in claim 3 , wherein the hot melt adhesive, upon being heated, softens so that it may be stretched to release the adhesive bond.

5. A vascular occlusion coil deployment system as defined in claim 4 , wherein said hot melt adhesive has a lower yield strength, upon being heated, than prior to being heated.

6. A vascular occlusion coil deployment system as defined in claim 4 , wherein said hot melt adhesive softens so that it may be stretched upon being heated to at least about 63 degrees Celsius.

7. A vascular occlusion coil deployment system as defined in claim 1 , wherein said adhesive bond of the heat responsive coupling member, upon being heated, breaks when said delivery member is retracted with respect to said positioning member to release said embolic coil.

8. A vascular occlusion coil deployment system as defined in claim 7 , wherein the release of said embolic coil comprises disengaging said heating element from said embolic coil by breaking said adhesive bond.

Assignments (1)
MERGER Recorded Jul 31, 2009
From: CORDIS NEUROVASCULAR, INC.
To: CODMAN & SHURTLEFF, INC.
Reel/Frame 023032/0233 →