Wire bond package and packaging method
View Patent ↗A method for packaging a plurality of dies is disclosed. Each die is attached to a corresponding mounting station in a structural member that includes a base member having first and second surfaces and a plurality of mounting stations. Each mounting station has a cavity wall that surrounds that mounting station and extends from the first surface thereby forming an open cavity around the mounting station. After the dies have mounted, a lid sheet is positioned over the structural member. The lid sheet includes a plurality of covers for closing the cavities. The covers are connected to one another by connection members. The structural member with the positioned lid sheet is then placed in a mold with a molding compound in contact with the lid sheet. The mold has a surface that forces the covers against the cavity while forcing the molding compound between the cavity walls.
1. A method for packaging a plurality of dies, said method comprising:
providing a structural member comprising a base member having first and second surfaces, said base member comprising a plurality of mounting stations, each mounting station comprising a cavity wall that surrounds that mounting station and extends from said first surface thereby forming an open cavity around said mounting station;
attaching each die to a corresponding one of said mounting stations;
positioning a lid sheet over said structural member, said lid sheet comprising a plurality of covers for closing said cavities said covers being connected to one another by connection members;
placing said structural member with said positioned lid sheet in a mold with a molding compound in contact with said lid sheet, said mold having a surface that forces said covers against said cavity while forcing said molding compound between said cavity walls; and
causing said molding compound to solidify.
2. The method of claim 1 wherein one of said connection members comprises a spring member that extends away from said covers and said first surface.
3. The method of claim 2 wherein said mold surface is in contact with said spring member when said molding compound is forced between said cavity walls.
4. The method of claim 1 wherein one of said mounting stations comprises a wire bonding pad and wherein said die is connected to said wire bonding pad when said die is attached to said mounting station.
5. The method of claim 1 wherein one of said mounting stations comprises a die mounting pad and wherein said die is connected to said die mounting pad by a layer of adhesive when said die is attached to said mounting station.
6. The method of claim 5 wherein said die mounting pad comprises a heat sink for removing heat from said die.
7. The method of claim 1 wherein said base member comprises a lead frame that is partially encased in a mold compound.