IP Library Granted Patent US 7,725,860
Granted Patent B1
US 7,725,860 · App. 10/728,894 · Granted May 25, 2010

Contact mapping using channel routing

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Quick Facts
Patent No.
US 7,725,860
App. No.
10/728,894
Granted
May 25, 2010
Kind
B1
Abstract

A technique for improved mapping of the contacts of a PLD to the contacts of one or more other electronic components are provided. In one particular exemplary embodiment, the technique may be realized as a method for mapping contacts of a programmable logic device (PLD) to an electronic component in a signal routing device having one or more layers. The method comprises assigning a set of one or more contacts of the PLD to one or more respective contacts of the electronic component based at least in part on a pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device.

Claims (41)

1. A method for mapping contacts of a programmable logic device (PLD) to contacts of an electronic component in a signal routing device having one or more layers, the method comprising:

providing a contact pattern for the programmable logic device (PLD);

determining a first pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device;

determining a first contact assignment pattern for one or more contacts of the PLD based at least in part on the first pattern of electrically conductive traces;

refining the first pattern of electrically conductive traces based at least in part on the first contact assignment pattern to generate a second pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device; and

assigning a set of one or more contacts of the PLD to one or more respective contacts of the electronic component based at least in part on the second pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device;

wherein the one or more channels are formed by arranging vias for contacts of at least the electronic component in the signal routing device.

2. The method as in claim 1 , further comprising the step of forming electrically conductive traces between the set of one or more contacts of the PLD and the respective contacts of the electronic component in accordance with the second pattern of electrically conductive traces.

3. The method as in claim 2 , wherein one or more of the electrically conductive traces are routed to respective contacts of the PLD via one or more channels formed at one or more layers of the signal routing device.

4. The method as in claim 1 , wherein the set of one or more contacts of the PLD are electronically assigned to the one or more respective contacts of the electronic component based at least in part on the second pattern of electrically conductive traces.

5. The method as in claim 1 , further comprising the step of:

assigning one or more contacts of the PLD to one or more respective contacts of a second electronic component of the signal routing device based at least in part on a pattern of electrically conductive traces routed from respective contacts of the second electronic component via one or more channels formed at one or more layers of the signal routing device.

6. The method as in claim 1 , further comprising the step of:

assigning one or more contacts of a second PLD to one or more respective contacts of the electronic component based at least in part on a second pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device.

7. The method as in claim 1 , wherein the set of one or more contacts of the PLD are assigned to the respective contacts of the electronic component by programming the PLD.

8. The method as in claim 1 , wherein the electronic component includes one of a group consisting of: a programmable logic device (PLD) and an application specific integrated circuit (ASIC).

9. A method for mapping contacts of a programmable logic device (PLD) to contacts of an electronic component in a signal routing device having one or more layers, the method comprising:

providing a contact pattern for the programmable logic device (PLD);

determining a first pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device;

determining a first contact assignment pattern for one or more contacts of the PLD based at least in part on the first pattern of electrically conductive traces;

refining the first pattern of electrically conductive traces based at least in part on the first contact assignment pattern to generate a second pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device; and

determining a second contact assignment pattern for one or more contacts of the PLD based at least in part on the second pattern of electrically conductive traces;

wherein the one or more channels are formed by arranging vias for contacts of at least the electronic component in the signal routing device.

10. The method as in claim 9 , further comprising the step of programming the PLD to assign contacts based at least in part on the second contact assignment pattern.

11. The method as in claim 9 , further comprising the steps of:

refining the second pattern of electrically conductive traces based at least in part on the second contact assignment pattern to generate a third pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device; and

determining a third contact assignment pattern for one or more contacts of the PLD based at least in part on the third pattern of electrically conductive traces.

12. The method as in claim 9 , further comprising the step of programming the PLD based at least in part on the third contact assignment pattern.

13. The method as in claim 9 , wherein the electronic component includes one of a group consisting of: a programmable logic device and an application specific integrated circuit (ASIC).

14. A signal routing device having one or more layers and further comprising:

an electronic component having a plurality of contacts;

a programmable logic device (PLD) having a plurality of contacts; and

a plurality of electrically conductive traces connecting contacts of the PLD to respective contacts of the electronic component, the plurality of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device after:

determining a first pattern of electrically conductive traces routed from respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device;

determining a first contact assignment pattern for one or more contacts of the PLD based at least in part on the first pattern of electrically conductive traces;

refining the first pattern of electrically conductive traces based at least in part on the first contact assignment pattern to generate a second pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device; and

assigning a set of one or more contacts of the PLD to one or more respective contacts of the electronic component based at least in part on the second pattern of electrically conductive traces routed from the respective contacts of the electronic component via one or more channels formed at one or more layers of the signal routing device;

wherein the one or more channels are formed by arranging vias for contacts of at least the electronic component in the signal routing device.

15. The signal routing device as in claim 14 , wherein the set of one or more contacts of the PLD are assigned to the respective contacts of the electronic component by programming the PLD.

16. The signal routing device as in claim 14 , wherein the electronic component includes one of a group consisting of: a programmable logic device and an application specific integrated circuit (ASIC).

17. The signal routing device as in claim 14 , wherein one or more of the electrically conductive traces are routed to respective contacts of the PLD via one or more channels formed at one or more layers of the signal routing device.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 20, 2023
From: BANK OF AMERICA, N.A.
To: CIENA CORPORATION
Reel/Frame 065630/0232 →
PATENT SECURITY AGREEMENT Recorded Nov 8, 2019
From: CIENA CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 050969/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 30, 2019
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: CIENA CORPORATION
Reel/Frame 050938/0389 →
PATENT SECURITY AGREEMENT Recorded Jul 16, 2014
From: CIENA CORPORATION
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 033347/0260 →
SECURITY INTEREST Recorded Jul 15, 2014
From: CIENA CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 033329/0417 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2010
From: CIENA LUXEMBOURG S.A.R.L.
To: CIENA CORPORATION
Reel/Frame 024252/0060 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2010
From: NORTEL NETWORKS LIMITED
To: CIENA LUXEMBOURG S.A.R.L.
Reel/Frame 024213/0653 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 8, 2003
From: KWONG HERMAN; SOH, KAH MING; HANDFORTH, MARTIN; MARCANTI, LARRY
To: NORTEL NETWORKS LIMITED
Reel/Frame 014779/0014 →